mpc755ed Freescale Semiconductor, Inc, mpc755ed Datasheet - Page 35

• Manufacturer Part Number: mpc755ed
• Description: Risc Microprocessor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

7.5
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
plastic ball grid array (PBGA).
7.6
Figure 20
PBGA package.
Freescale Semiconductor
2X
A1 CORNER
0.2
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
Package Parameters for the MPC755 PBGA
Mechanical Dimensions for the MPC755
Figure 20. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC755,
provides the mechanical dimensions and bottom surface nomenclature for the MPC755, 360
B
E
e
E1
1 2 3 4 5 6 7 8 9 10 111213141516
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
360X
D1
D
b
0.75 mm (29.5 mil)
360 (19 × 19 ball array – 1)
1.27 mm (50 mil)
2.22 mm
2.77 mm
25 × 25 mm
0.15
0.3
360 PBGA Package
171819
2X
C
C
0.2
A
A
W
U
M
B
V
R
P
N
K
H
G
E
D
C
B
A
T
L
J
F
0.2 C
A
A1
A2
A3
C
NOTES:
1. DIMENSIONING AND TOLERANCING
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
PER ASME Y14.5M, 1994.
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
DIM
A1
A2
A3
D1
E1
A
D
b
E
e
2.22
0.50
1.00
0.60
Min
Millimeters
—
25.00 BSC
25.00 BSC
1.27 BSC
6.75
7.87
Package Description
Max
2.77
0.70
1.20
0.60
0.90
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