mpc755ed Freescale Semiconductor, Inc, mpc755ed Datasheet - Page 25

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mpc755ed

Manufacturer Part Number
mpc755ed
Description
Risc Microprocessor Hardware Specifications
Manufacturer
Freescale Semiconductor, Inc
Datasheet
5
Figure 16
Part B shows the side profile of the PBGA package to indicate the direction of the top surface view.
Part A
Freescale Semiconductor
Part B
Pin Assignments
(in Part A) shows the pinout of the MPC745, 255 PBGA package as viewed from the top surface.
Figure 16. Pinout of the MPC745, 255 PBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
1
2
Substrate Assembly
3
Encapsulant
4
5
6
7
Not to Scale
8
View
9
10 11 12 13 14 15 16
Die
Pin Assignments
25

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