mpc755ed Freescale Semiconductor, Inc, mpc755ed Datasheet - Page 34

• Manufacturer Part Number: mpc755ed
• Description: Risc Microprocessor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

Package Description
7.3
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
ceramic ball grid array (CBGA).
7.4
Figure 19
360 CBGA package.
34
2X
A1 CORNER
0.2
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
Package Parameters for the MPC755 CBGA
Mechanical Dimensions for the MPC755 CBGA
Figure 19. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC755,
provides the mechanical dimensions and bottom surface nomenclature for the MPC755,
e
E
E1
1 2 3 4 5 6 7 8 9 10 111213141516
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
360X
D1
D
b
360 (19 × 19 ball array – 1)
1.27 mm (50 mil)
2.65 mm
3.20 mm
25 × 25 mm
0.89 mm (35 mil)
0.15
0.3
171819
360 CBGA Package
2X
C
C
A
0.2
A
W
B
V
U
R
N
M
K
H
G
D
C
B
A
T
P
L
J
F
E
0.2 C
A
A3
A2
A1
C
NOTES:
1. DIMENSIONING AND TOLERANCING
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
PER ASME Y14.5M, 1994.
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER
IS DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
DIM
A1
A2
A3
D1
E1
A
D
b
E
e
Freescale Semiconductor
2.65
0.79
1.10
0.82
Min
Millimeters
—
25.00 BSC
25.00 BSC
1.27 BSC
6.75
7.87
Max
3.20
0.99
1.30
0.60
0.93