MTW32N25E Motorola, MTW32N25E Datasheet - Page 5

no-image

MTW32N25E

Manufacturer Part Number
MTW32N25E
Description
TMOS POWER FET
Manufacturer
Motorola
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MTW32N25E
Manufacturer:
MOTOROLA
Quantity:
187
Part Number:
MTW32N25E
Manufacturer:
NXP
Quantity:
30 000
www.DataSheet4U.com
the maximum simultaneous drain–to–source voltage and
drain current that a transistor can handle safely when it is for-
ward biased. Curves are based upon maximum peak junc-
tion temperature and a case temperature (T C ) of 25 C. Peak
repetitive pulsed power limits are determined by using the
thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal Resistance–General
Data and Its Use.”
verse any load line provided neither rated peak current (I DM )
nor rated voltage (V DSS ) is exceeded and the transition time
(t r ,t f ) do not exceed 10 s. In addition the total power aver-
aged over a complete switching cycle must not exceed
(T J(MAX) – T C )/(R JC ).
in switching circuits with unclamped inductive loads. For reli-
Motorola TMOS Power MOSFET Transistor Device Data
The Forward Biased Safe Operating Area curves define
Switching between the off–state and the on–state may tra-
A Power MOSFET designated E–FET can be safely used
12
10
8
6
4
2
0
0
Figure 8. Gate–To–Source and Drain–To–Source
10
Q1
Q3
20
Voltage versus Total Charge
30
Q T , TOTAL CHARGE (nC)
40
Q2
QT
50
DRAIN–TO–SOURCE DIODE CHARACTERISTICS
32
24
16
V DS
8
0
60
0.5
Figure 10. Diode Forward Voltage versus Current
V GS = 0 V
T J = 25 C
0.55
70
V GS
V SD , SOURCE–TO–DRAIN VOLTAGE (VOLTS)
80
0.6
I D = 32 A
T J = 25 C
SAFE OPERATING AREA
0.65
90
100
0.7
300
250
200
150
100
50
0
0.75
able operation, the stored energy from circuit inductance dis-
sipated in the transistor while in avalanche must be less than
the rated limit and adjusted for operating conditions differing
from those specified. Although industry practice is to rate in
terms of energy, avalanche energy capability is not a con-
stant. The energy rating decreases non–linearly with an in-
crease of peak current in avalanche and peak junction
temperature.
to–source avalanche at currents up to rated pulsed current
(I DM ), the energy rating is specified at rated continuous cur-
rent (I D ), in accordance with industry custom. The energy rat-
ing must be derated for temperature as shown in the
accompanying graph (Figure 12). Maximum energy at cur-
rents below rated continuous I D can safely be assumed to
equal the values indicated.
0.8
1000
Although many E–FETs can withstand the stress of drain–
100
10
0.85
1
V DD = 125 V
I D = 32 A
V GS = 10 V
T J = 25 C
0.9
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
0.95
t d(off)
t d(on)
R G , GATE RESISTANCE (OHMS)
1.0
t f
t r
10
MTW32N25E
100
5

Related parts for MTW32N25E