GS1559 Gennum Corp., GS1559 Datasheet - Page 20

• Manufacturer Part Number: GS1559
• Description: GS1559 HD-LINX-TM II Multi-Rate Deserializer with Loop-Through Cable Driver
• Manufacturer: Gennum Corp.

2.4 Solder Reflow Profiles
The GS1559 is available in a Pb or Pb-free package. It is recommended that the
Pb package be soldered with Pb paste using the Standard Eutectic profile shown
in
reflow profile shown in
NOTE: It is possible to solder a Pb-free package with Pb paste using a Standard
Eutectic profile with a reflow temperature maintained at 245
Figure 2-1: Standard Eutectic Solder Reflow Profile (Pb package, Pb paste)
Temperature
260˚C
250˚C
217˚C
200˚C
150˚C
Figure 2-2: Maximum Pb-free Solder Reflow Profile (Pb-free package, Pb-free
paste)
30572 - 4
230˚C
220˚C
183˚C
150˚C
100˚C
Temperature
25˚C
25˚C
Figure
2-1, and the Pb-free package be soldered with Pb-free paste using the
July 2005
Figure
2-2.
120 sec. max
60-180 sec. max
8 min. max
6 min. max
3˚C/sec max
3˚C/sec max
60-150 sec.
60-150 sec.
10-20 sec.
20-40 sec.
GS1559 Data Sheet
o
C – 250
o
C.
6˚C/sec max
6˚C/sec max
20 of 74
Time
Time