ISL55142IVZ Intersil, ISL55142IVZ Datasheet - Page 11

IC COMP CMOS HS 18V 20-TSSOP

ISL55142IVZ

Manufacturer Part Number
ISL55142IVZ
Description
IC COMP CMOS HS 18V 20-TSSOP
Manufacturer
Intersil
Type
Windowr
Datasheet

Specifications of ISL55142IVZ

Number Of Elements
2
Voltage - Supply
10 V ~ 18 V
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
6.40
0.20 C B A
4.40 ±0.10
2
SEATING
PLANE
C
(0.65 TYP)
(5.65)
0.10 C
TYPICAL RECOMMENDED LAND PATTERN
3
H
14
1
11
5.00 ±0.10
SIDE VIEW
TOP VIEW
0.65
1
0.25 +0.05/-0.06
0.10
3
0.05
8
7
ISL55141, ISL55142, ISL55143
CBA
A
I.D. MARK
(0.35 TYP)
PIN #1
1.20 MAX
(1.45)
B
5
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
2. Dimension does not include interlead flash or protrusion. Interlead
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation AB-1.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
flash or protrusion shall not exceed 0.25 per side.
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
0.90 +0.15/-0.10
0.15 MAX
0.05 MIN
DETAIL "X"
SEE
0.09-0.20
DETAIL "X"
END VIEW
1.00 REF
GAUGE
PLANE
0.60 ±0.15
0°-8°
March 1, 2011
0.25
FN6230.2

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