ISL55142IVZ Intersil, ISL55142IVZ Datasheet - Page 10

• Manufacturer Part Number: ISL55142IVZ
• Description: IC COMP CMOS HS 18V 20-TSSOP
• Manufacturer: Intersil
• Type: Windowr

Specifications of ISL55142IVZ

• Number Of Elements: 2
• Voltage - Supply: 10 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
10
ISL55141, ISL55142, ISL55143
L16.4x4A
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220-VGGD-10)
NOTES:
10. Depending on the method of lead termination at the edge of the
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
6. The configuration of the pin #1 identifier is optional, but must be
7. Dimensions D2 and E2 are for the exposed pads which provide
8. Nominal dimensions are provided to assist with PCB Land
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
SYMBOL
between 0.15mm and 0.30mm from the terminal tip.
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
improved electrical and thermal performance.
Pattern Design efforts, see Intersil Technical Brief TB389.
Anvil singulation method is used and not present for saw
singulation.
package, a maximum 0.15mm pull back (L1) maybe present.
L minus L1 to be equal to or greater than 0.3mm.
A1
A2
A3
D1
D2
E1
E2
Nd
Ne
L1
A
D
E
N
P
b
e
k
L
θ
0.80
0.18
2.30
2.30
0.25
0.30
MIN
-
-
-
-
-
MILLIMETERS
NOMINAL
0.20 REF
4.00 BSC
3.75 BSC
4.00 BSC
3.75 BSC
0.50 BSC
0.90
0.25
2.40
2.40
0.40
16
4
4
-
-
-
-
-
-
MAX
1.00
0.05
1.00
0.30
2.55
2.55
0.50
0.15
0.60
12
-
Rev. 2 3/06
March 1, 2011
NOTES
5, 8
7, 8
7, 8
FN6230.2
10
9
9
9
9
8
2
3
3
9
9
-
-
-
-
-
-