PMEG2010EPK NXP Semiconductors, PMEG2010EPK Datasheet - Page 9

• Manufacturer Part Number: PMEG2010EPK
• Description: Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 Surface-Mounted Device (SMD) plastic package with visible and solderab
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Package outline
10. Soldering
PMEG2010EPK
Product data sheet
Fig 15. Package outline SOD1608
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering footprint for SOD1608
Footprint information for reflow soldering of SOD1608 package
solder land
solder paste deposit
occupied area
0.9
solder land plus solder paste
solder resist
Dimensions in mm
0.8
Dimensions in mm
0.7
All information provided in this document is subject to legal disclaimers.
0.80
0.72
0.40
0.32
1
Rev. 1 — 20 January 2012
0.85
0.75
0.75
0.67
1.15
1.05
0.95
2
1.8
1.9
2.0
1.65
1.55
20 V, 1 A low VF MEGA Schottky barrier rectifier
0.1
0.2
0.40
0.34
0.04
0.75
0.65
0.55
2
11-11-21
PMEG2010EPK
0.7 0.8
0.9
© NXP B.V. 2012. All rights reserved.
sod1608_fr
SOD1608
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