PMEG2010EPK NXP Semiconductors, PMEG2010EPK Datasheet - Page 4
![Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 Surface-Mounted Device (SMD) plastic package with visible and solderab](/photos/41/52/415251/sod1608_3d_sml.gif)
PMEG2010EPK
Manufacturer Part Number
PMEG2010EPK
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 Surface-Mounted Device (SMD) plastic package with visible and solderab
Manufacturer
NXP Semiconductors
Datasheet
1.PMEG2010EPK.pdf
(13 pages)
NXP Semiconductors
PMEG2010EPK
Product data sheet
Fig 2.
Fig 3.
Z
Z
(K/W)
(K/W)
th(j-a)
th(j-a)
10
10
10
10
10
10
3
2
3
2
10
10
FR4 PCB, standard footprint
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
FR4 PCB, mounting pad for cathode 1 cm
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
-3
-3
0.75
0.33
0.05
0.75
0.33
0.05
duty cycle =
duty cycle =
0.2
0.2
0
0
0.25
0.02
0.01
0.25
0.02
0.01
0.5
0.1
0.5
0.1
1
1
10
10
-2
-2
All information provided in this document is subject to legal disclaimers.
10
10
-1
-1
Rev. 1 — 20 January 2012
2
1
1
20 V, 1 A low VF MEGA Schottky barrier rectifier
10
10
PMEG2010EPK
10
10
2
2
t
t
p
p
© NXP B.V. 2012. All rights reserved.
(s)
(s)
006aac952
006aac953
10
10
3
3
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