PMEG2010EPK NXP Semiconductors, PMEG2010EPK Datasheet - Page 7

• Manufacturer Part Number: PMEG2010EPK
• Description: Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 Surface-Mounted Device (SMD) plastic package with visible and solderab
• Manufacturer: NXP Semiconductors

NXP Semiconductors
PMEG2010EPK
Product data sheet
Fig 9.
Fig 11. Average forward current as a function of
P
I
F(AV)
R(AV)
(W)
(A)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.5
1.0
0.5
0.0
function of reverse voltage; typical values
ambient temperature; typical values
T
(1) δ = 1
(2) δ = 0.9
(3) δ = 0.8
(4) δ = 0.5
Average reverse power dissipation as a
FR4 PCB, mounting pad for cathode 1 cm
T
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
0
0
j
j
= 125 °C
= 150 °C
(1)
(2)
(3)
(4)
25
5
50
75
10
100
125
15
(1)
(2)
(3)
T
All information provided in this document is subject to legal disclaimers.
amb
006aac959
V
006aac961
150
R
(°C)
(V)
(4)
175
Rev. 1 — 20 January 2012
20
2
Fig 10. Average forward current as a function of
Fig 12. Average forward current as a function of
I
I
20 V, 1 A low VF MEGA Schottky barrier rectifier
F(AV)
F(AV)
(A)
(A)
1.5
1.0
0.5
0.0
1.5
1.0
0.5
0.0
ambient temperature; typical values
ambient temperature; typical values
FR4 PCB, standard footprint
T
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Ceramic PCB, Al
T
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
0
0
j
j
= 150 °C
= 150 °C
(1)
(2)
(3)
(4)
(1)
(2)
(3)
(4)
25
25
50
50
PMEG2010EPK
2
75
75
O
3
, standard footprint
100
100
125
125
© NXP B.V. 2012. All rights reserved.
T
T
amb
amb
006aac960
006aac962
150
150
(°C)
(°C)
175
175
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