MT48LC32M8A2P-7E:DTR Micron Technology Inc, MT48LC32M8A2P-7E:DTR Datasheet - Page 17

• Manufacturer Part Number: MT48LC32M8A2P-7E:DTR
• Manufacturer: Micron Technology Inc

Specifications of MT48LC32M8A2P-7E:DTR

• Lead Free Status / Rohs Status: Compliant

Figure 9: 54-Ball VFBGA "FG" (8mm x 14mm) (x16)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
SEATING PLANE
54X Ø0.45
6.40
0.10 C
3.20 ±0.05
BALL A9
Notes:
C
0.65 ±0.05
3.20 ±0.05
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.065mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
0.80 TYP
BALL A1
0.80 TYP
7.00 ±0.05
BALL A1 ID
17
14.00 ±0.10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.00 MAX
256Mb: x4, x8, x16 SDRAM
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø 0.40
Package Dimensions
© 1999 Micron Technology, Inc. All rights reserved.
BALL A1 ID