MT4LC4M16F5TG-5 Micron Technology Inc, MT4LC4M16F5TG-5 Datasheet

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MT4LC4M16F5TG-5

Manufacturer Part Number
MT4LC4M16F5TG-5
Description
Manufacturer
Micron Technology Inc
Type
FPMr
Datasheet

Specifications of MT4LC4M16F5TG-5

Organization
4Mx16
Density
64Mb
Address Bus
12b
Access Time (max)
25ns
Maximum Clock Rate
Not RequiredMHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
105mA
Pin Count
50
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT4LC4M16F5TG-5F
Manufacturer:
MICRON
Quantity:
15
DRAM
FEATURES
• Single +3.3V ±0.3V power supply
• Industry-standard x16 pinout, timing, functions,
• 12 row, 10 column addresses
• High-performance CMOS silicon-gate process
• All inputs, outputs and clocks are LVTTL-compatible
• FAST PAGE MODE (FPM) access
• 4,096-cycle CAS#-BEFORE-RAS# (CBR) REFRESH
OPTIONS
• Plastic Package
• Timing
• Refresh Rate
KEY TIMING PARAMETERS
GENERAL DESCRIPTION
dynamic random-access memory device containing
67,108,864 bits organized in a x16 configuration. The
MT4LC4M16F5 is functionally organized as 4,194,304
locations containing 16 bits each. The 4,194,304
memory locations are arranged in 4,096 rows by 1,024
columns. During READ or WRITE cycles, each location
is uniquely addressed via the address bits: 12 row-
address bits (A0-A11) and 10 column-address bits (A0-
A9). In addition, both byte and word accesses are
supported via the two CAS# pins (CASL# and CASH#).
The CAS# functionality and timing related to address
and control functions (e.g., latching column addresses
or selecting CBR REFRESH) are such that the internal
4 Meg x 16 FPM DRAM
D28_2.p65 – Rev. 5/00
SPEED
and packages
distributed across 64ms
50-pin TSOP (400 mil)
50ns access
60ns access
Standard Refresh
The 4 Meg x 16 DRAM is a high-speed CMOS,
-5
-6
110ns
90ns
t
RC
MT4LC4M16F5TG-5
Part Number Example
t
50ns
60ns
RAC
30ns
35ns
t
PC
25ns
30ns
t
MARKING
AA
None
TG
-5
-6
t
13ns
15ns
CAC
1
MT4LC4M16F5
For the latest data sheet, please refer to the Micron
Web site: www.micron.com/mti/msp/html/
datasheet.html
CAS# signal is determined by the first external CAS#
signal (CASL# or CASH#) to transition LOW and the last
to transition back HIGH. The CAS# functionality and
timing related to driving or latching data are such that
each CAS# signal independently controls the associ-
ated eight DQ pins.
the column address by CAS#. The device provides FAST-
PAGE-MODE operation, allowing for fast successive
data operations (READ, WRITE, or READ-MODIFY-
WRITE) within a given row.
cally in order to retain stored data.
NOTE: 1. The # symbol indicates signal is active LOW.
The row address is latched by the RAS# signal, then
RAS#
WE#
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
V
V
V
V
Micron Technology, Inc., reserves the right to change products or specifications without notice.
The MT4LC4M16F5 must be refreshed periodi-
NC
NC
NC
NC
NC
A0
A1
A2
A3
A4
A5
CC
CC
CC
CC
PIN ASSIGNMENT (Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50-Pin TSOP
4 MEG x 16
FPM DRAM
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
©2000, Micron Technology, Inc.
OBSOLETE
V
DQ15
DQ14
DQ13
DQ12
V
DQ11
DQ10
DQ9
DQ8
NC
V
CASL#
CASH#
OE#
NC
NC
NC
A11
A10
A9
A8
A7
A6
V
SS
SS
SS
SS

Related parts for MT4LC4M16F5TG-5

MT4LC4M16F5TG-5 Summary of contents

Page 1

... FAST PAGE MODE (FPM) access • 4,096-cycle CAS#-BEFORE-RAS# (CBR) REFRESH distributed across 64ms OPTIONS • Plastic Package 50-pin TSOP (400 mil) • Timing 50ns access 60ns access • Refresh Rate Standard Refresh Part Number Example MT4LC4M16F5TG-5 KEY TIMING PARAMETERS SPEED RC RAC PC -5 90ns 50ns ...

Page 2

... FAST PAGE MODE ACCESS Each location in the DRAM is uniquely addressable, as mentioned in the General Description. Use of both CAS# signals results in a word access via the 16 I/O pins (DQ0-DQ15). Use of only one of the two results in a BYTE access cycle. CASL# transitioning LOW selects an ...

Page 3

... DRAM REFRESH The supply voltage must be maintained at the speci- fied levels, and the refresh requirements must be met in order to retain stored data in the DRAM. The refresh requirements are met by refreshing all rows in the DRAM array at least once every 64ms. The recom- mended procedure is to execute 4,096 CBR REFRESH cycles, either uniformly spaced or grouped in bursts, every 64ms ...

Page 4

... RAS# CASL# CASH# WE# LOWER BYTE (DQ0-DQ7) OF WORD UPPER BYTE (DQ8-DQ15) OF WORD 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 WORD READ STORED OUTPUT OUTPUT STORED STORED DATA DATA DATA DATA DATA ADDRESS High-Z Figure 2 WORD and BYTE READ Example 4 4 MEG x 16 ...

Page 5

... REFRESH CURRENT: CBR Average power supply current t (RAS#, CAS#, address cycling Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 *Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional ...

Page 6

... Output buffer turn-off delay OE# setup prior to RAS# during HIDDEN REFRESH cycle FAST-PAGE-MODE READ or WRITE cycle time FAST-PAGE-MODE READ-WRITE cycle time Access time from RAS# RAS# to column-address delay time Row-address hold time 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 = +3.3V ±0.3V SYMBOL MIN ...

Page 7

... Transition time (rise or fall) WRITE command hold time WRITE command hold time (referenced to RAS#) WE# command setup time WRITE command pulse width WE# hold time (CBR Refresh) WE# setup time (CBR Refresh) 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 = +3.3V ±0.3V SYMBOL MIN ...

Page 8

... OFF (MAX) defines the time at which the output achieves the open circuit condition and is not referenced Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/ 18. = +3.3V restrictive operating parameters. CC EARLY WRITE cycles. If cycle is an EARLY WRITE cycle and the data output will remain an open circuit throughout the entire cycle ...

Page 9

... Last rising CASx# edge to first falling CASx# edge. 32. First DQs controlled by the first CASx LOW. 33. Last DQs controlled by the last CASx HIGH. 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 34. Each CASx# must meet minimum pulse width. 35. Last CASx LOW. 36. All DQs controlled, regardless CASL# and CASH#. 37. V ...

Page 10

... CAH 8 t CAS 13 10,000 t CLCH 5 t CLZ 3 t CRP 5 t CSH Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 READ CYCLE RAS t CSH t RSH t RCD t CAS RAD t RAH t ASC t CAH COLUMN t RCS RAC t CAC t CLZ OPEN -6 MAX UNITS SYMBOL t 30 ...

Page 11

... CAS 13 10,000 t CLCH 5 t CRP 5 t CSH 50 t CWL RAD 13 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 EARLY WRITE CYCLE RAS t CSH t RSH t RCD t CAS RAD t RAH t ASC t CAH COLUMN t CWL t RWL t WCR t WCS t WCH VALID DATA -6 MIN ...

Page 12

... CLCH 5 t CLZ 3 t CRP 5 t CSH 50 t CWD 36 t CWL Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 READ-WRITE CYCLE t RWC t RAS t CSH t RSH t RCD t CAS RAD t RAH t ASC t CAH COLUMN t RWD t RCS t CWD t AWD RAC t CAC t CLZ OPEN t OE ...

Page 13

... CAH 8 t CAS 13 10,000 t CLCH 5 t CLZ CPA 30 t CRP 5 t CSH Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 FAST-PAGE-MODE READ CYCLE t RASP RCD t CAS ASC t CAH t ASC COLUMN COLUMN t RCS t RCH RAC t CAC t OFF t CLZ t CLZ VALID DATA MIN ...

Page 14

... ASR 0 t CAH 8 t CAS 13 10,000 t CLCH CRP 5 t CSH 50 t CWL Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 t RASP RCD t CAS ASC t CAH t ASC COLUMN COLUMN t CWL t WCH t WCS WCR VALID DATA VALID DATA -6 MIN MAX UNITS SYMBOL ...

Page 15

... CPA 30 t CRP 5 t CSH 50 t CWD 36 t CWL NOTE for LATE WRITE only. 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 t RASP t CSH NOTE 1 t RCD t CAS ASC t CAH t ASC COLUMN COLUMN t RWD t RCS t CWL AWD t CWD CPA CAC t CAC ...

Page 16

... CRP 5 t CSH 50 t CWL NOTE not drive input data prior to output data going High-Z. 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 (Pseudo READ-MODIFY-WRITE) t RASP t CSH t RCD t CAS RAD t RAH t ASC t CAH COLUMN t RCS t CAC t CLZ t OFF VALID OPEN DATA ...

Page 17

... CRP 5 t CSR 5 t RAH 8 NOTE: 1. End of first CBR REFRESH cycle. 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 RAS#-ONLY REFRESH CYCLE (OE# and WE# = DON’T CARE) t RAS t RAH ROW OPEN CBR REFRESH CYCLE (Addresses and OE# = DON’T CARE) t RAS ...

Page 18

... CHR 15 t CLZ 3 t CRP NOTE HIDDEN REFRESH may also be performed after a WRITE cycle. In this case, WE# is LOW and OE# is HIGH. 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 HIDDEN REFRESH CYCLE (WE# = HIGH; OE# = LOW RAS RCD t RSH RAD t ASC t CAH COLUMN ...

Page 19

... Package width and length do not include mold protrusion; allowable mold protrusion is .25mm per side. 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992 Micron is a registered trademark of Micron Technology, Inc. 4 Meg x 16 FPM DRAM D28_2.p65 – Rev. 5/00 50-PIN PLASTIC TSOP (400 mil) .88 TYP 11 ...

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