74HC2G66DP,125 NXP Semiconductors, 74HC2G66DP,125 Datasheet
74HC2G66DP,125
Specifications of 74HC2G66DP,125
74HC2G66DP-G
935272945125
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74HC2G66DP,125 Summary of contents
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Dual single-pole single-throw analog switch Rev. 8 — 23 September 2010 1. General description 74HC2G66 and 74HCT2G66 are high-speed Si-gate CMOS devices. They are dual single-pole single-throw analog switches. Each switch has two input/output pins (nY and nZ) ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74HC2G66DP 74HCT2G66DP 74HC2G66DC 74HCT2G66DC 74HC2G66GT 74HCT2G66GT 74HC2G66GD 74HCT2G66GD 5. Functional diagram Fig 1. Logic symbol 74HC_HCT2G66 Product data sheet Marking H66 T66 H66 T66 H66 T66 H66 T66 001aag497 Fig 2. All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning 74HC2G66 74HCT2G66 GND 4 001aai699 Fig 3. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) Fig 5. Pin configuration SOT996-2 (XSON8U) 6.2 Pin description Table 3. Pin description Symbol Pin 1Y 1Z GND 4 1E 74HC_HCT2G66 Product data sheet 74HC2G66; 74HCT2G66 Dual single-pole single-throw analog switch ...
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... NXP Semiconductors 7. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O V switch voltage SW T ambient temperature amb Δt/ΔV input transition rise and fall rate [1] To avoid drawing V ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter C input capacitance I C power dissipation PD capacitance C ON-state capacitance S(ON) 74HCT2G66 V HIGH-level IH input voltage V LOW-level IL input voltage I input leakage current I I OFF-state S(OFF) leakage current I ON-state S(ON) leakage current ...
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... NXP Semiconductors 10.2 ON resistance Table 8. ON resistance for 74HC2G66 and 74HCT2G66 At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graph see Symbol Parameter [1] 74HC2G66 R ON resistance (peak) ON(peak resistance (rail) ON(rail) ΔR ON resistance mismatch ON between channels 74HCT2G66 R ON resistance (peak) ...
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... NXP Semiconductors 10.3 ON resistance test circuit and graphs GND Fig 8. Test circuit for measuring ON resistance 11. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Symbol Parameter Conditions 74HC2G66 t propagation delay nY see enable time nZ; see disable time ...
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... NXP Semiconductors Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Symbol Parameter Conditions 74HCT2G66 t propagation delay nY see V t enable time nZ; see disable time nZ; see dis V C power dissipation V = GND capacitance [1] All typical values are measured at T [2] ...
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... NXP Semiconductors Measurement points are given in Logic levels: V and Fig 11. Enable and disable times Table 10. Measurement points Type Input V M 74HC2G66 0.5V CC 74HCT2G66 1.3 V 74HC_HCT2G66 Product data sheet input V M GND t PLZ V CC output LOW-to-OFF OFF-to-LOW PHZ V OH output HIGH-to-OFF OFF-to-HIGH ...
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... NXP Semiconductors negative Test data is given in Table Definitions for test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 12. Test circuit for measuring switching times Table 11. Test data Type Input ...
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... NXP Semiconductors Table 12. Additional dynamic characteristics for 74HC2G66 and 74HCT2G66 GND = 6.0 ns pF; unless otherwise specified. All typical values are measured Symbol Parameter −3 dB frequency f (−3dB) response α isolation (OFF-state) iso V crosstalk voltage ct Xtalk crosstalk 11.3 Test circuits and graphs V CC ...
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... NXP Semiconductors 5 (dB) 0 − Test conditions 4.5 V; GND = Fig 15. Typical −3 dB frequency response Adjust the switch input voltage for a 0 dBm level (0 dBm = 1 mW into 600 Ω) Fig 16. Test circuit for measuring isolation (OFF-state) 74HC_HCT2G66 Product data sheet 74HC2G66; 74HCT2G66 Ω ...
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... NXP Semiconductors 0 (dB) −20 −40 −60 −80 −100 Test conditions 4.5 V; GND = Fig 17. Typical isolation (OFF-state function of frequency a. Circuit b. Crosstalk voltage Adjust the switch input voltage for a 0 dBm level (0 dBm = 1 mW into 600 Ω) Fig 18. Test circuit for measuring crosstalk voltage (between the digital input and the switch) ...
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... NXP Semiconductors Adjust the switch input voltage for a 0 dBm level (0 dBm = 1 mW into 600 Ω) Fig 19. Test circuit for measuring crosstalk (between the switches) 74HC_HCT2G66 Product data sheet 1E 0.1 μ CHANNEL CHANNEL OFF All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 12. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 23. Package outline SOT996-2 (XSON8U) ...
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... NXP Semiconductors 13. Abbreviations Table 13. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model DUT Device Under Test 14. Revision history Table 14. Revision history Document ID Release date 74HC_HCT2G66 v.8 20100923 • Modifications: Figure 74HC_HCT2G66 v.7 20100914 • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales office addresses, please send an email to: 74HC_HCT2G66 Product data sheet 74HC2G66 ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics 10.1 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10.2 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 ...