CC-9M-NA37-Z1-B Digi International, CC-9M-NA37-Z1-B Datasheet - Page 128

• Manufacturer Part Number: CC-9M-NA37-Z1-B
• Description: MOD 9M 64MB SDRAM 128MB FLASH 25
• Manufacturer: Digi International
• Series: -r

Specifications of CC-9M-NA37-Z1-B

• Module/board Type: Core Module
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: Networking

www.digiembedded.com
Recommendations
The maximum component case temperature must remain below the maximum,
measured at the devices shown in the figure below.
When attaching thermocouples, please follow the guidelines listed below:
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Management in applications with operating temperatures at the high end or beyond
the specified standard ambient temperature range.
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Carefully remove any labels or other foreign material from the component.
Ensure an adhesive with high thermal conductivity is used. Use as little
adhesive as possible.
Make sure the thermocouple is touching the case of the component and not
“floating” in the adhesive.
The use of precision, fine-wire K-type thermocouples is strongly
recommended.
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Providing air movement will improve heat dissipation.
The host PCB plays a large part in dissipating the heat generated by the
module. A large copper plane located on the host ground PCB will improve the
heat dissipation capabilities of the PCB.
Omega Engineering P/N 5TC-TT-K-36-72, or similar
Measure Tcase of U22
Measure Tcase of U3
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