SI7913DN-T1-E3 Siliconix / Vishay, SI7913DN-T1-E3 Datasheet - Page 2

• Manufacturer Part Number: SI7913DN-T1-E3
• Description: DUAL P-CHANNEL 20-V (D-S) MOSFET
• Manufacturer: Siliconix / Vishay

Specifications of SI7913DN-T1-E3

• Channel Type: P
• Current, Drain: -7.4 A
• Fall Time: 225 ns
• Gate Charge, Total: 24 nC
• Operating And Storage Temperature: –55 to +150 °C
• Package Type: PowerPAK 1212-8
• Polarization: P-Channel
• Power Dissipation: 1.3 W
• Resistance, Drain To Source On: 0.037 Ohm
• Resistance, Thermal, Junction To Case: 5 °C/W
• Temperature, Operating, Maximum: +150 °C
• Temperature, Operating, Minimum: –55 °C
• Thermal Resistance, Junction To Ambient: 44 °C/W
• Time, Rise: 110 ns
• Time, Turn-off Delay: 110 ns
• Time, Turn-on Delay: 30 ns
• Transconductance, Forward: 20 S
• Voltage, Breakdown, Drain To Source: –30 V
• Voltage, Diode Forward: –1.2 V
• Voltage, Drain To Source: –20 V
• Voltage, Forward, Diode: –1.2 V
• Voltage, Gate To Source: ±8 V
• Trenchfet® Power Mosfet: 1.8 V Rated
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

Si7913DN
Vishay Siliconix
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
www.vishay.com
2
SPECIFICATIONS T
Parameter
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Diode Forward Voltage
Dynamic
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
b
20
16
12
8
4
0
0
a
a
V
DS
Output Characteristics
1
a
J
- Drain-to-Source Voltage (V)
V
= 25 °C, unless otherwise noted
GS
= 5 thru 2.5 V
a
2
Symbol
R
V
I
t
t
I
I
DS(on)
V
GS(th)
D(on)
Q
Q
d(on)
d(off)
GSS
DSS
Q
g
R
t
t
t
SD
rr
fs
gs
gd
r
f
g
g
3
V
1 V
1.5 V
DS
2 V
V
I
D
DS
≅ - 1 A, V
= - 10 V, V
I
F
= - 20 V, V
V
V
V
V
V
V
V
V
= - 2.3 A, dI/dt = 100 A/µs
4
V
DS
GS
GS
GS
DS
I
S
DD
DS
DS
DS
= - 2.3 A, V
Test Conditions
≤ - 5 V, V
= V
= - 4.5 V, I
= - 2.5 V, I
= - 1.8 V, I
= - 20 V, V
= - 10 V, R
= - 6 V, I
= 0 V, V
GEN
f = 1 MHz
GS
GS
GS
, I
= - 4.5 V, I
= - 4.5 V, R
D
= 0 V, T
GS
GS
D
= - 250 µA
D
D
D
GS
= - 7.4 A
GS
L
= - 4.5 V
= - 7.4 A
= - 6.5 A
= - 1.5 A
= ± 8 V
= 10 Ω
= 0 V
= 0 V
J
D
= 85 °C
g
= - 7.4 A
20
16
12
= 6 Ω
8
4
0
0.0
0.5
V
- 0.40
Min.
Transfer Characteristics
25 °C
- 20
GS
T
- Gate-to-Source Voltage (V)
C
= 125 °C
1.0
0.029
0.038
0.051
- 0.74
Typ.
15.3
150
2.0
3.9
20
20
70
72
25
S-83050-Rev. C, 29-Dec-08
7
Document Number: 72615
1.5
- 55 °C
± 100
0.037
0.048
0.066
Max.
- 1.0
- 1.2
110
110
225
- 1
- 5
24
30
50
2.0
Unit
nC
nA
µA
ns
Ω
Ω
V
A
S
V
2.5