MPC5200BV400 Freescale Semiconductor, MPC5200BV400 Datasheet - Page 9

• Manufacturer Part Number: MPC5200BV400
• Description: IC MPU 32BIT 400MHZ 272-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC5200BV400

• Processor Type: MPC52xx PowerPC 32-Bit
• Speed: 400MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 272-PBGA
• Family Name: MPC52xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 400MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5V
• Operating Supply Voltage (max): 1.58V
• Operating Supply Voltage (min): 1.42V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

1.1.6
1.1.6.1
An estimation of the chip-junction temperature, T
where:
The junction to ambient thermal resistance is an industry standard value, which provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single layer board, and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is correct depends on the power dissipated by other components on the board. The value obtained on a single layer board
is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal resistance and a case
to ambient thermal resistance:
Freescale Semiconductor
1
2
3
4
5
6
Junction to Ambient
Natural Convection
Junction to Ambient
Natural Convection
Junction to Ambient (@200
ft/min)
Junction to Ambient (@200
ft/min)
Junction to Board
Junction to Case
Junction to Package Top
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
T
R
P
A
D
θJA
= ambient temperature for the package (ºC)
= power dissipation in package (W)
Thermal Characteristics
= junction to ambient thermal resistance (ºC/W)
Heat Dissipation
Rating
Single layer board
(1s)
Four layer board (2s2p)
Single layer board
(1s)
Four layer board
(2s2p)
Natural Convection
Table 7. Thermal Resistance Data
Board Layers
T
MPC5200B Data Sheet, Rev. 4
J
—
—
J
, can be obtained from the following equation:
= T
A
+(R
θ
JA
×
P
R
R
R
Sym
R
R
R
D
Ψ
θJMA
θJMA
θJMA
θJC
θJA
θJB
)
JT
Value
30
22
24
19
14
8
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
(1),(2)
(1),(3)
(1),(3)
(1),(3)
(4)
(5)
(6)
SpecID
D6.1
D6.2
D6.3
D6.4
D6.5
D6.6
D6.7
Eqn. 3
9