MPC755CRX400LE Freescale Semiconductor, MPC755CRX400LE Datasheet - Page 6

• Manufacturer Part Number: MPC755CRX400LE
• Description: IC MPU 32BIT 400MHZ PPC 360-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC755CRX400LE

• Processor Type: MPC7xx PowerPC 32-Bit
• Speed: 400MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Family Name: MPC7xx
• Device Core: PowerPC
• Device Core Size: 64b
• Frequency (max): 400MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2V
• Operating Supply Voltage (max): 2.1V
• Operating Supply Voltage (min): 1.9V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 360
• Package Type: FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Electrical and Thermal Characteristics
4
This section provides the AC and DC electrical specifications and thermal characteristics for the MPC755.
4.1
Table 1
maximum ratings.
6
Core supply voltage
PLL supply voltage
L2 DLL supply voltage
Processor bus supply voltage
L2 bus supply voltage
Input voltage
Storage temperature range
Notes:
1. Functional and tested operating conditions are given in
2. Caution: V in must not exceed OV
3. Caution: L2OV
4. Caution: V
5. This is a DC specifications only. V
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
reset and power-down sequences, L2OV
for up to 40 ms. Excursions beyond 3.3 V or 40 ms are not supported.
reset and power-down sequences, V
for up to 40 ms. Excursions beyond 1.0 V or 40 ms are not supported.
Packages
Core power supply
I/O power supply
Electrical and Thermal Characteristics
through
DC Electrical Characteristics
DD
/AV
DD
Table 7
DD
/OV
/L2AV
Characteristic
DD
must not exceed V
describe the MPC755 DC electrical characteristics.
DD
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Processor bus
L2 bus
JTAG signals
must not exceed L2OV
in
DD
MPC745: Surface mount 255 plastic ball grid array (PBGA)
MPC755: Surface mount 360 ceramic ball grid array (CBGA)
Surface mount 360 plastic ball grid array (PBGA)
2.0 V ± 100 mV DC (nominal; some parts support core voltages down to
1.8 V; see
2.5 V ± 100 mV DC or
3.3 V ± 165 mV DC (input thresholds are configuration pin selectable)
may overshoot/undershoot to a voltage and for a maximum duration as shown in
DD
or L2OV
Table 1. Absolute Maximum Ratings
/AV
DD
DD
/OV
DD
/L2AV
DD
/AV
DD
Table 3
by more than 0.3 V at any time including during power-on reset.
DD
may exceed V
DD
DD
/L2AV
may exceed L2OV
/OV
Table
for recommended operating conditions)
DD
DD
by more than 1.6 V during normal operation. During power-on
by more than 0.4 V during normal operation. During power-on
3. Absolute maximum ratings are stress ratings only, and
DD
Symbol
L2OV
L2AV
OV
AV
/AV
V
T
V
V
V
DD
stg
DD
in
in
in
DD
DD
DD
DD
DD
/L2AV
/OV
DD
DD
–0.3 to L2OV
–0.3 to OV
1
by up to 3.3 V for up to 20 ms, or by 2.5 V
by up to 1.0 V for up to 20 ms, or by 0.7 V
Maximum Value
–0.3 to 2.5
–0.3 to 2.5
–0.3 to 2.5
–0.3 to 3.6
–0.3 to 3.6
–0.3 to 3.6
–55 to 150
Table 1
DD
DD
+ 0.3 V
+ 0.3 V
provides the absolute
Freescale Semiconductor
Unit
°C
V
V
V
V
V
V
V
V
Figure
Notes
2, 5
2, 5
4
4
4
3
3
2.