MPC755CRX400LE Freescale Semiconductor, MPC755CRX400LE Datasheet - Page 50

IC MPU 32BIT 400MHZ PPC 360-CBGA

MPC755CRX400LE

Manufacturer Part Number
MPC755CRX400LE
Description
IC MPU 32BIT 400MHZ PPC 360-CBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC755CRX400LE

Processor Type
MPC7xx PowerPC 32-Bit
Speed
400MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
360-FCCBGA
Family Name
MPC7xx
Device Core
PowerPC
Device Core Size
64b
Frequency (max)
400MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2V
Operating Supply Voltage (max)
2.1V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
360
Package Type
FCCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC755CRX400LE
Manufacturer:
MOT
Quantity:
12 388
Part Number:
MPC755CRX400LE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Document Revision History
9
Table 19
50
Revision
6.1
8
7
6
5
Document Revision History
provides a revision history for this hardware specification.
4/05/2005 Removed phrase “for the ceramic ball grid array (CBGA) package” from Section 8.8; this information
1/21/2005 Updated document template.
2/8/2006 Changed processor descriptor from ‘B’ to ‘C’ for 350 MHz devices and increased power specifications
Date
for full-power mode in
applies to devices in both CBGA and PBGA packages.
Figure 24—updated COP Connector Diagram to recommend a weak pull-up resistor on TCK.
Table 20—added MPC745BPXLE, MPC755BRXLE, MPC755BPXLE, MPC755CVTLE,
MPC755BVTLE and MPC745BVTLE part numbers. These devices are fully addressed by this
document.
Corrected Revision Level in Table 23: Rev E devices are Rev 2.8, not 2.7.
Added MPC755CRX400LE and MPC755CPX400LE to devices supported by this specification in
Table 20.
Removed “Advance Information” from title block on page 1.
Removed 450 MHz speed grade throughout document. These devices are no longer supported for new
designs; see Section 1.10.2 for more information.
Relaxed voltage sequencing requirements in Notes 3 and 4 of Table 1.
Corrected Note 2 of Table 7.
Changed processor descriptor from ‘B’ to ‘C’ for 400 MHz devices and increased power specifications
for full-power mode in Table 7. XPC755Bxx400LE devices are no longer produced and are documented
in a separate part number specification; see Section 1.10.2 for more information.
Increased power specifications for sleep mode for all speed grades in Table 7.
Removed ‘Sleep Mode (PLL and DLL Disabled)—Typical’ specification from Table 7; this is no longer
tested or characterized.
Added Note 4 to Table 7.
Revised L2 clock duty cycle specification in Table 11 and changed Note 7.
Corrected Note 3 in Table 20.
Replaced Table 21 and added Tables 22 and 23.
Added Note 6 to Table 10; clarification only as this information is already documented in the MPC750
RISC Microprocessor Family User’s Manual.
Revised Figure 24 and Section 1.8.7.
Corrected Process Identifier for 450 MHz part in Table 20.
Added XPC755BRXnnnTx series to Table 21.
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Table 19. Document Revision History
Table
7.
Substantive Change(s)
Freescale Semiconductor

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