CY7C63723C-SXC Cypress Semiconductor Corp, CY7C63723C-SXC Datasheet - Page 51

IC MCU 8K LS USB/PS-2 18-SOIC

CY7C63723C-SXC

Manufacturer Part Number
CY7C63723C-SXC
Description
IC MCU 8K LS USB/PS-2 18-SOIC
Manufacturer
Cypress Semiconductor Corp
Series
enCoRe™r
Datasheet

Specifications of CY7C63723C-SXC

Package / Case
18-SOIC (7.5mm Width)
Applications
USB Microcontroller
Core Processor
M8B
Program Memory Type
OTP (8 kB)
Controller Series
CY7C637xx
Ram Size
256 x 8
Interface
PS2, USB
Number Of I /o
10
Voltage - Supply
3.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Product
USB and PS/2 Controller
Number Of I/os
10
Operating Supply Voltage
11 V
Supply Current (max)
20 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Maximum Power Dissipation
300 mW
Number Of Timers
4
Core Size
8 Bit
No. Of I/o's
10
Program Memory Size
8KB
Ram Memory Size
256Byte
Cpu Speed
12MHz
No. Of Timers
1
Embedded Interface Type
PS/2, USB
Digital Ic Case Style
SOIC
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-1855

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C63723C-SXC
Manufacturer:
CYPRESS
Quantity:
12 000
Part Number:
CY7C63723C-SXC
Manufacturer:
CY
Quantity:
1 000
Part Number:
CY7C63723C-SXC
Manufacturer:
CY
Quantity:
1 000
Part Number:
CY7C63723C-SXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Table 11
left corner of the die which has coordinate (0,0).
Table 11. CY7C63722C-XC Probe Pad Coordinates in microns ((0,0) to bond pad centers)
Document #: 38-08022 Rev. *D
below shows the die pad coordinates for the CY7C63722C-XC. The center location of each bond pad is relative to the bottom
Pad Number
10
12
13
14
15
16
17
18
19
20
21
22
23
24
25
11
1
2
3
4
5
6
7
8
9
Die Step: 1907 x 3011 microns
Die Size: 1830.8 x 2909 microns
Die Thickness: 14 mils = 355.6 microns
Pad Size: 80 x 80 microns
Pin Name
XTALOUT
XTALIN
VREG
P0.5
P0.4
P0.0
P0.1
P0.2
P0.3
P1.0
P1.2
P1.4
P1.6
P1.7
P1.5
P1.3
P1.1
P0.7
P0.6
Vpp
Vss
Vss
Vcc
D–
D+
Cypress Logo
Y
Figure 56. Die Form
(0,0)
10
4
5
6
7
8
9
X
17
22
21
20
19
18
(1907, 3001)
(microns)
1066.55
1210.75
1449.75
1662.35
1735.35
1752.05
1752.05
1752.05
1752.05
1752.05
1393.25
1171.80
154.95
980.35
788.95
597.45
406.00
154.95
154.95
154.95
154.95
154.95
154.95
363.90
531.70
X
(microns)
2843.15
2843.15
2843.15
2687.95
2496.45
2305.05
2113.60
1922.05
1730.90
1832.75
2024.30
2215.75
2407.15
2598.65
2843.15
2843.15
2843.15
184.85
184.85
184.85
184.85
289.85
312.50
184.85
184.85
CY7C63722C
CY7C63723C
CY7C63743C
Y
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