ADSP-21375KSZ-2B Analog Devices Inc, ADSP-21375KSZ-2B Datasheet - Page 47

• Manufacturer Part Number: ADSP-21375KSZ-2B
• Description: IC DSP 32BIT 266MHZ 208-MQFP
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21375KSZ-2B

• Interface: DAI, DPI
• Clock Rate: 266MHz
• Non-volatile Memory: ROM (256 kB)
• On-chip Ram: 64kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 208-MQFP, 208-PQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

THERMAL CHARACTERISTICS
The ADSP-21371/ADSP-21375 processor is rated for perfor-
mance over the temperature range specified in
Conditions on Page
Table 44
JESD51-2 and JESD51-6 and the junction-to-board measure-
ment complies with JESD51-8. Test board design complies with
JEDEC standards JESD51-7 (LQFP_EP). The junction-to-case
measurement complies with MIL- STD-883. All measurements
use a 2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use
where:
T
T
package
Ψ
is the Typical value from
P
Values of θ
design considerations. θ
mation of T
where:
T
Values of θ
design considerations when an external heatsink is required.
D
J
CASE
A
JT
= junction temperature °C
= power dissipation
= ambient temperature °C
= junction-to-top (of package) characterization parameter
= case temperature (°C) measured at the top center of the
Figure 39. Typical Output Delay or Hold vs. Load Capacitance
10
-4
-2
8
4
2
0
6
airflow measurements comply with JEDEC standards
0
JA
JC
J
by the equation
are provided for package comparison and PCB
are provided for package comparison and PCB
Y = 0.0488X - 1.5923
T
J
T
16.
(at Ambient Temperature)
=
J
50
=
T
JA
Table
CASE
T
can be used for a first order approxi-
A
LOAD CAPACITANCE (pF)
+
44.
+
(
θ
100
(
JA
Ψ
JT
×
P
×
D
P
)
D
)
150
Operating
Rev. B | Page 47 of 52 | June 2008
200
Values of θ
design considerations. Note that the thermal characteristics val-
ues provided in
Table 44. Thermal Characteristics for 208-Lead LQFP
E_PAD (With Exposed Pad Soldered to PCB)
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Ψ
Ψ
Ψ
JA
JMA
JMA
JC
JT
JMT
JMT
JB
JMB
JMB
JB
are provided for package comparison and PCB
Table 44
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
ADSP-21371/ADSP-21375
are modeled values.
Typical
17.1
14.7
14.0
9.6
0.23
0.39
0.45
11.5
11.2
11.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W