MSC8126MP8000 Freescale Semiconductor, MSC8126MP8000 Datasheet

no-image

MSC8126MP8000

Manufacturer Part Number
MSC8126MP8000
Description
DSP 16BIT 500MHZ MULTI 431FCPBGA
Manufacturer
Freescale Semiconductor
Series
MSC81xx StarCorer
Type
SC140 Corer

Specifications of MSC8126MP8000

Interface
DSI, Ethernet, RS-232
Clock Rate
500MHz
Non-volatile Memory
External
On-chip Ram
1.436MB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
0°C ~ 90°C
Mounting Type
Surface Mount
Package / Case
431-FCPBGA
For Use With
MSC8126ADSE - KIT ADVANCED DEV SYSTEM 8126
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MSC8126MP8000
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Freescale Semiconductor
Data Sheet:
Quad Digital Signal
Processor
• Four StarCore™ SC140 DSP extended cores, each with an SC140
• 475 Kbyte M2 memory for critical data/temporary data buffering.
• 4 Kbyte boot ROM.
• M2-accessible multi-core MQBus connecting the M2 memory
• Internal PLL configured are reset by configuration signal values.
• 60x-compatible system bus with 64 or 32 bit data and 32-bit
• Direct slave interface (DSI) using a 32/64-bit slave interface with
• Three mode signal multiplexing: 64-bit DSI/32-bit system bus,
• Flexible memory controller with three UPMs, a GPCM, a
• Multi-channel DMA controller with 16 time-multiplexed single
© Freescale Semiconductor, Inc., 2004, 2008. All rights reserved.
DSP core, 224 Kbyte of internal SRAM M1 memory (1436 Kbyte
total), 16 way 16 Kbyte instruction cache (ICache), four-entry
write buffer, external cache support, programmable interrupt
controller (PIC), local interrupt controller (LIC), and low-power
Wait and Stop processing modes.
with all four cores, operating at the core frequency, with data bus
access of up to 128-bit reads and up to 64-bit writes, central
efficient round-robin arbiter for core access to the bus, and atomic
control of M2 memory access by the cores and local bus.
address bus, support for multi-master designs, four-beat burst
transfers (eight-beat in 32-bit data mode), port size of 64/32/16/8
bits controlled by the internal memory controller,.access to
external memory or peripherals, access by an external host to
internal resources, slave support with direct access to internal
resources including M1 and M2 memories, and on-device
arbitration for up to four master devices.
21–25 bit addressing and 32/64-bit data transfers, direct access by
an external host to internal/external resources, synchronous or
asynchronous accesses with burst capability in synchronous
mode, dual or single strobe mode, write and read buffers to
improve host bandwidth, byte enable signals for 1/2/4/8-byte
write granularity, sliding window mode for access using a reduced
number of address pins, chip ID decoding to allow one CS signal
to control multiple DSPs, broadcast mode to write to multiple
DSPs, and big-endian/little-endian/munged support.
32-bit DSI/64-bit system bus, or 32-bit DSI/32-bit system bus.
page-mode SDRAM machine, glueless interface to a variety of
memories and devices, byte enables for 64-/32-bit bus widths, 8
memory banks for external memories, and 2 memory banks for
IPBus peripherals and internal memories.
channels, up to four external peripherals, DONE or DRACK
protocol for two external peripherals,.service for up to 16 internal
requests from up to 8 internal FIFOs per channel, FIFO generated
watermarks and hungry requests, priority-based
time-multiplexing between channels using 16 internal priority
• Up to four independent TDM modules with programmable word
• Ethernet controller: support for 10/100 Mbps MII/RMII/SMII
• UART with full-duplex operation up to 6.25 Mbps.
• Up to 32 general-purpose input/output (GPIO) ports.
• I
• Two timer modules, each with sixteen configurable 16-bit timers.
• Eight programmable hardware semaphores.
• Global interrupt controller (GIC) with interrupt consolidation and
• Boot options: external memory, external host, UART, TDM, or
• VCOP with fully programmable feed-forward channel decoding,
• TCOP with full support for 3GPP and CDMA2000 standards in
levels or round-robin time-multiplexing between channels,
flexible channel configuration with connection to local bus or
system bus, and flyby transfer support that bypasses the FIFO.
size (2, 4, 8, or 16-bit), hardware-base A-law/μ-law conversion,
up to 128 Mbps data rate for all channels, with glueless interface
to E1 or T1 framers, and can interface with H-MVIP/H.110
devices, TSI, and codecs such as AC-97.
including full- and half-duplex operation, full-duplex flow
controls, out-of-sequence transmit queues, programmable
maximum frame length including jumbo frames and VLAN tags
and priority, retransmission after collision, CRC generation and
verification of inbound/outbound packets, address recognition
(including exact match, broadcast address, individual hash check,
group hash check, and promiscuous mode), pattern matching,
insertion with expansion or replacement for transmit frames,
VLAN tag insertion, RMON statistics, local bus master DMA for
descriptor fetching and buffer access, and optional multiplexing
with GPIO (MII/RMII/SMII) or DSI/system bus signals lines
(MII/RMII).
routing to INT_OUT, NMI_OUT, and the cores; thirty-two virtual
maskable interrupts (8 per core) and four virtual NMI (one per
core) that can be generated by a simple write access.
I
feed-forward channel equalization and traceback sessions. Up to
400 3GPP 12.2 kbps AMR channels (channel decoding, number
of channels linear to frequency). Up to 200 blind transport format
detect (BTFD) channels according to the 3GPP standard. Number
of channels linear to frequency.
Turbo decode; up to 20 turbo-coding 384 kbps channels; 8 state
PCCC with polynomial as supported by the 3G standards;
iterative decoding structure based on Maximum A-Posteriori
probability (MAP), with calculations performed in the LOG
domain.
2
2
C interface that allows booting from EEPROM devices.
C.
MSC8126
Document Number: MSC8126
FC PBGA–431
20 mm × 20 mm
Rev. 15, 12/2008

Related parts for MSC8126MP8000

MSC8126MP8000 Summary of contents

Page 1

... FIFOs per channel, FIFO generated watermarks and hungry requests, priority-based time-multiplexing between channels using 16 internal priority © Freescale Semiconductor, Inc., 2004, 2008. All rights reserved. Document Number: MSC8126 MSC8126 FC PBGA–431 20 mm × ...

Page 2

... Figure 30.Boundary Scan (JTAG) Timing Diagram . . . . . . . . . . . . 38 Figure 31.Test Access Port Timing Diagram . . . . . . . . . . . . . . . . . 39 Figure 32.TRST Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 39 and Figure 33.Core Power Supply Decoupling Raised Together . . 17 Figure 34.V CCSYN with CLKIN Figure 35.MSC8126 Mechanical Information, 431-pin FC-PBGA DDH Package CCSYN Bypass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Freescale Semiconductor ...

Page 3

... The QBus interface includes a bus switch, write buffer, fetch unit, and a control unit that defines four QBus banks. In addition, the QBC handles internal memory contentions. Figure 2. StarCore SC140 DSP Extended Core Block Diagram MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor SC140 SC140 Extended Core ...

Page 4

... This section includes diagrams of the MSC8126 package ball grid array layouts and pinout allocation tables. 1.1 FC-PBGA Ball Layout Diagrams Top and bottom views of the FC-PBGA package are shown in Figure 3 and Figure 4 with their ball location index numbers. MSC8126 Quad Digital Signal Processor Data Sheet, Rev Freescale Semiconductor ...

Page 5

... HD4 GND GND DDH HD7 HD15 HD9 HD60 DDH HD14 HD12 HD10 HD63 HD59 DD AB GND HD13 HD11 HD8 HD62 HD61 MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Top View GND GND GND GND GND GND HCID3 GND ...

Page 6

... GND GND HD4 DDH DDH GND HD58 HD60 HD9 DDH DD V GND HD59 HD63 HD10 HD12 DDH HD56 HD57 HD61 HD62 HD8 HD11 Freescale Semiconductor GND DD EE0 TDI TRST TCK RST PO CONF RESET HA27 HA24 HA28 HA20 DD HA26 HA18 DD HA21 HA15 ...

Page 7

... GND C11 V DD C12 GND C13 V DD C14 GND C15 GND C16 GPIO30/TIMER2/TMCLK/SDA C17 GPIO2/TIMER1/CHIP_ID2/IRQ6 MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Des. Signal Name C18 GPIO1/TIMER0/CHIP_ID1/IRQ5/ETHTXD1 C19 GPIO7/TDM3RCLK/IRQ5/ETHTXD3 C20 GPIO3/TDM3TSYN/IRQ1/ETHTXD2 C21 GPIO5/TDM3TDAT/IRQ3/ETHRXD3 C22 GPIO6/TDM3RSYN/IRQ4/ETHRXD2 D2 TDI D3 EE0 D4 EE1 ...

Page 8

... GND G21 GPIO17/TDM1TDAT/DACK1 G22 GPIO22/TDM0TCLK/DONE2/DRACK2 H2 HA20 H3 HA28 HA19 H6 TEST H7 PSDCAS/PGPL3 H8 PGTA/PUPMWAIT/PGPL4/PPBS H10 BM1/TC1/BNKSEL1 H11 ARTRY H12 AACK H13 DBB/IRQ5 H14 HTA H15 V DD H16 TT4/CS7 H17 CS4 H18 GPIO24/TDM0RSYN/IRQ14 H19 GPIO21/TDM0TSYN H20 V DD K15 V DD K16 TT2/CS5 K17 ALE Freescale Semiconductor ...

Page 9

... GND K14 CLKOUT M15 V DDH M16 HBRST M17 V DDH M18 V DDH M19 GND M20 V DDH MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Des. Signal Name K18 CS2 K19 GND K20 A26 K21 A29 K22 A28 L2 HA12 L3 HA14 L4 HA11 L5 ...

Page 10

... TSZ1 R9 TSZ3 R10 IRQ1/GBL R11 V DD R12 V DD R13 V DD R14 TT0/HA7 R15 IRQ7/DP7/DREQ4 R16 IRQ6/DP6/DREQ3 R17 IRQ3/DP3/DREQ2/EXT_BR3 R18 TS R19 IRQ2/DP2/DACK2/EXT_DBG2 R20 A17 R21 A18 R22 A16 T2 HD17 T3 HD21 T4 HD1/DSISYNC T5 HD0/SWTE U21 A12 U22 A13 V2 HD3/MODCK1 V3 V DDH V4 GND Freescale Semiconductor ...

Page 11

... HD32/D32/reserved W19 GND W20 GND W21 A7 W22 A6 Y2 HD7 Y3 HD15 Y4 V DDH Y5 HD9 MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Des. Signal Name V9 D7 V10 D10 V11 D12 V12 D13 V13 D18 V14 D20 V15 GND V16 D24 ...

Page 12

... AB3 HD13 AB4 HD11 AB5 HD8 AB6 HD62/D62 AB7 HD61/D61 AB8 HD57/D57/ETHRX_ER AB9 HD56/D56/ETHRX_DV/ETHCRS_DV AB10 HD55/D55/ETHTX_ER/reserved AB11 HD53/D53 AB12 HD50/D50 AB13 HD49/D49/ETHTXD3/reserved AB14 HD48/D48/ETHTXD2/reserved AB15 HD47/D47/ETHTXD1 AB16 HD45/D45 AB17 HD44/D44 AB18 HD41/D41/ETHRXD1 AB19 HD39/D39/reserved AB20 HD36/D36/reserved AB21 A1 AB22 V DD Freescale Semiconductor ...

Page 13

... Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond the listed limits may affect device reliability or cause permanent damage. 3. Section 3.5, Thermal Considerations includes a formula for computing the chip junction temperature (T MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor CAUTION ). DD Table 2. Absolute Maximum Ratings ...

Page 14

... V 3.135 to 3.465 DDH V –0 –40 to 105 J FC-PBGA × Symbol Natural Convection (1 m/s) airflow R 26 θ θ θJB R 0.9 θJC Ψ Unit +0.2 V DDH °C °C 5 Unit 200 ft/min 21 °C/W 15 °C/W °C/W °C/W °C/W Freescale Semiconductor ...

Page 15

... To assure proper board design with regard to thermal dissipation and maintaining proper operating temperatures, evaluate power consumption for your application and use the design guidelines in Chapter 4 of this document and in MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601). MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor DC DC and ...

Page 16

... For designs with separate power supplies, bring up the V DDH reaches its nominal level) before V DDH V power-up. CLKIN can toggle during this period. DDH V is raised after V DDH DD and Typical Impedance (Ω PORESET V and V DD DDH and CLKIN begins to toggle as V rises. DDH Freescale Semiconductor V DD are ...

Page 17

... V 2.2 V 1.2 V o.5 V Figure 6. Start-Up Sequence: V 3.3 V 1.2 V o.5 V PORESET/TRST asserted V applied DD Figure 7. Start-Up Sequence: V MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor V = Nominal Value DDH V = Nominal Value DD 1 PORESET/TRST Deasserted CLKIN Starts Toggling PORESET/TRST Asserted V /V Applied ...

Page 18

... F 20 CLKIN F 40 BCLK F 40 REFCLK F 40 CLKOUT F 200 CORE (IO) t (time CCSYN / voltage level CCSYN Maximum in MHz 400/500 133/166 133/166 133/166 500 MHz Device Max Min Max 133.3 20 166.7 133.3 40 166.7 133.3 40 166.7 133.3 40 166.7 400 200 500 Freescale Semiconductor ...

Page 19

... TAP Table 11 summarizes the reset actions that occur as a result of the different reset sources. MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Table 9. System Clock Parameters ) Table 10. Reset Sources ...

Page 20

... Yes Yes Yes Yes Yes Yes Yes PORESET must be asserted externally for at least 16 Soft Reset (SRESET) JTAG Command: External EXTEST, CLAMP, or HIGHZ Yes Yes Yes Depends on command Yes Yes Yes Yes CLKIN cycles after deassertion to define the Reset PORESET Freescale Semiconductor ...

Page 21

... HRESET Output (I/O) SRESET Output (I/O) Figure 9. Timing Diagram for a Reset Configuration Write MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor , CNFGS, DSISYNC, DSI64, RSTCONF , RSTCONF, CNFGS, DSISYNC, DSI64 CHIP_ID[0–3], BM[0–2], SWTE, MODCK[1–2] pins are sampled ...

Page 22

... MSC8126 Quad Digital Signal Processor Data Sheet, Rev Tick Spacing (T1 Occurs at the Rising Edge of REFCLK) T2 1/4 REFCLK 1/2 REFCLK 1/6 REFCLK 1/2 REFCLK 2/10 REFCLK 1/2 REFCLK 3/4 REFCLK 4/6 REFCLK 7/10 REFCLK for 1:4, 1:6, 1:8, 1:10 for 1:3 for 1:5 Freescale Semiconductor ...

Page 23

... Values are measured from the 50% TTL transition level relative to the 50% level of the REFCLK rising edge. 3. Guaranteed by design No. Characteristic 2 30 Minimum delay from the 50% level of the REFCLK for all signals MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Table 14. AC Timing for SIU Inputs 133 0.5 3.0 3.3 2.9 3.4 4.0 1 ...

Page 24

... Freescale Semiconductor Units ...

Page 25

... Data bus inputs—ECC and parity modes Address bus/TS /TT[0–4]/TC[0–2]/ TBST/TSZ[0–3]/GBL inputs Address bus/TT[0–4]/TC[0–2]/TBST/TSZ[0–3]/GBL outputs Memory controller/ALE outputs AACK/ABB/TS/DBG/BG/BR/DBB/CS outputs MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor REFCLK 11 PSDVAL/ABB/DBB inputs inputs ...

Page 26

... Figure 12 shows the relationship between the CLKIN MSC8126 Quad Digital Signal Processor Data Sheet, Rev skew timing. Table 16. CLKOUT Skew CLKIN CLKOUT 20 Figure 12. CLKOUT and CLKIN Signals Min Max Units 0 0.85 ns –0.8 1.0 ns 2.8 — ns and timings. CLKOUT CLKIN 21 Freescale Semiconductor ...

Page 27

... DACK/DRACK/DONE delay after the 50% level of the REFCLK rising edge signal is synchronized with The DREQ according to the timings in Table 17. Figure 13 shows synchronous peripheral interaction. DACK/DONE/DRACK MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Table 17. DMA Signals . To achieve fast response, a synchronized peripheral should assert REFCLK REFCLK 37 ...

Page 28

... T ) REFCLK 1 REFCLK — 8.5 2.0 — 2.2 — 2.2 — 3.2 — — 7.4 — 6.7 — 6.5 — 6.5 — REFCLK 5 + (1.5 × REFCLK 5 + (2.5 × REFCLK 1 — REFCLK 1.0 — 1.7 — 1.5 — Freescale Semiconductor Unit ...

Page 29

... HTA released at logic 0 (DCR[HTAAD end of access; used with pull-down implementation. 4. HTA released at logic 1 (DCR[HTAAD end of access; used with pull-up implementation. Figure 14. Asynchronous Single- and Dual-Strobe Modes Read Timing Diagram MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor 100 101 112 102 103 107 ...

Page 30

... Used for single-strobe mode access. 2. Used for dual-strobe mode access. Figure 16. Asynchronous Broadcast Write Timing Diagram MSC8126 Quad Digital Signal Processor Data Sheet, Rev 100 112 201 106 108 100 112 201 202 101 102 202 109 110 111 101 102 Freescale Semiconductor ...

Page 31

... All other input signals HD[0–63] output signals HTA output signal Figure 17. DSI Synchronous Mode Signals Timing Diagram MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Table 19. DSI Inputs—Synchronous Mode Expression (0.5 ± 0.1) × HTC (0.5 ± 0.1) × HTC ...

Page 32

... Figure 19. TDM Output Signals Ref = CLKIN Expression Units Min Max — ns (0.5 ± 0.1) × — ns (0.5 ± 0.1) × — ns 1.3 — ns 1.0 — ns 2.8 — ns — 8.8 ns 2.5 — ns — 10.5 ns — 8.5 ns 2.5 — ns 308 307 310 Freescale Semiconductor ...

Page 33

... URXD and UTXD inputs high/low duration 401 URXD and UTXD inputs rise/fall time 402 UTXD output rise/fall time UTXD, URXD inputs UTXD output MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Table 22. UART Timing Expression 16 × T 401 401 400 Figure 20. UART Input Timing 402 402 Figure 21 ...

Page 34

... MSC8126 Quad Digital Signal Processor Data Sheet, Rev Table 23. Timer Timing Characteristics 500 501 502 503 Figure 22. Timer Timing Characteristics 801 802 Valid Ref = CLKIN Unit Min Max 10.0 — ns 4.0 — ns 4.0 — ns 3.1 9.5 ns 2.8 8.1 ns Min Max Unit 10 — — ns Freescale Semiconductor ...

Page 35

... ETHREF_CLK rising edge to ETHTXD[0–1], ETHTX_EN output delay. ETHREF_CLK ETHCRS_DV ETHRXD[0–1] ETHRX_ER ETHTX_EN ETHTXD[0–1] MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Table 25. MII Mode Signal Timing Characteristics 803 Valid 805 Valid Figure 24. MII Mode Signal Timing Table 26 ...

Page 36

... Max Unit 1.0 — ns 1.0 — 1.5 6 1.5 5.0 ns Valid Ref = CLKIN Ref = CLKOUT Unit Min Max Min Max — 6.1 — 6.9 ns 1.1 — 1.3 — ns — 5.4 — 6.2 ns 3.5 — 3.7 — ns 0.5 — 0.5 — ns Freescale Semiconductor ...

Page 37

... TCK clock pulse width measured at V • High • Low 703 TCK rise and fall times MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor High Impedance 604 605 Valid Figure 27. GPIO Timing Table 29. EE Pin Timing Type Asynchronous ...

Page 38

... Input Data Valid 706 Output Data Valid 707 All frequencies Unit Min Max 5.0 — 20.0 — 0.0 30.0 0.0 30.0 5.0 — 20.0 — 0.0 20.0 0.0 20.0 100.0 — 30.0 — 702 V M 703 V IH 705 Freescale Semiconductor ...

Page 39

... TDO (Output) TDO (Output) Figure 31. Test Access Port Timing Diagram TCK (Input) TRST (Input) 712 MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor 708 Input Data Valid 710 Output Data Valid 711 713 Figure 32. TRST Timing Diagram V IH 709 ...

Page 40

... The ESD protection diode can allow this to occur when V DDH + 0.8V. DDH level of V – 0.8 V before it is enabled. DDH more than 2 CCSYN CLKIN / first and then bring CCSYN V going down first and DDH by more than 0 any time, including during supply through the DD exceeds V DD Freescale Semiconductor must DDH ...

Page 41

... PCB aligned with the depopulated void on the MSC8126 located in the square defined by positions, L11, L12, L13, M11, M12, M13, N11, N12, and N13 MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Maximum IR drop Bulk/Tantalum capacitors with low ESR and ESL Figure 33 ...

Page 42

... CLKIN CLKOUT is the main clock to SDRAM. Use the following . CLKIN CLKOUT must not exceed 0.7 ns. should be pulled either HTA / / HWBS[1–3] HDBS[1–3] HWBE[1– PSDDQM[4–7] PBS[4– HDBS[1–3] HWBE[1–3] HDBE[1– and . TEA PSDVAL AACK Freescale Semiconductor / ...

Page 43

... SDRAM to ensure correct operation within your system design. The output delay listed in SDRAM specifications is usually given for a load of 30 pF. Scale the number to your specific board load using the typical scaling number provided by the SDRAM manufacturer. MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor must not exceed 10 pF. CLKOUT (if SIUMCR[INTODC] is cleared), ...

Page 44

... × (θ Core Operating Spheres Voltage Temperature Lead-free 1.2 V –40° to 105°C Lead-bearing Lead-free Lead-bearing Eqn with natural Eqn. 2 Core Frequency Order Number (MHz) 400 MSC8126TVT6400 MSC8126TMP6400 0° to 90°C 500 MSC8126VT8000 MSC8126MP8000 Freescale Semiconductor ...

Page 45

... Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8126 device. • SC140 DSP Core Reference Manual. Covers the SC140 core architecture, control registers, clock registers, program control, and instruction set. MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Package Information Notes: 1. All dimensions in millimeters. 2. Dimensioning and tolerancing per ASME Y14.5M– ...

Page 46

... Clarified the wording of note 2 in Table 24. MSC8126 Quad Digital Signal Processor Data Sheet, Rev Table 31. Document Revision History Description 2 C timing changed to GPIO timing. . DDH + 8% in Figure 2-1. DDH + 17% in Figure 2-1. DDH Table maximum and reference value to 0 Table Freescale Semiconductor ...

Page 47

... MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15 Freescale Semiconductor Revision History 47 ...

Page 48

... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...

Related keywords