MT49H8M36FM-5 Micron Technology Inc, MT49H8M36FM-5 Datasheet - Page 16

• Manufacturer Part Number: MT49H8M36FM-5
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H8M36FM-5

• Organization: 8Mx36
• Density: 288Mb
• Address Bus: 22b
• Maximum Clock Rate: 200MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: uBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 567mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

Package Dimensions
Figure 7:
PDF: 09005aef80a41b59/Source: 09005aef809f284b
288Mb_RLDRAM_II_CIO_D2.fm - Rev N 5/08 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. THE
PRE-REFLOW BALL
DIAMETER IS 0.50 ON A
0.40 SMD BALL PAD.
17.00
SEATING PLANE
144X Ø 0.45
15.40
0.08 A
144-Ball µBGA
8.50
Notes:
A
BALL A12
MOLD
COMPOUND
4.40
1. All dimensions are in millimeters.
11.00 ±0.10
10.70 CTR
2.41 CTR
8.80
288Mb: x9, x18, x36 2.5V V
10º TYP
5.50 ±0.05
0.08 MAX
1.00 TYP
9.25 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
18.50 ±0.10
16
Micron Technology, Inc., reserves the right to change products or specifications without notice.
EXT
, 1.8V V
17.90 CTR
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
62% Sn, 36% Pb, 2%Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
0.39 ±0.05
0.44 ±0.05
DD
, HSTL, CIO, RLDRAM II
Package Dimensions
©2003 Micron Technology, Inc. All rights reserved.
BALL A1 ID