IXP2400 Intel, IXP2400 Datasheet - Page 68

• Manufacturer Part Number: IXP2400
• Manufacturer: Intel

Specifications of IXP2400

• Operating Supply Voltage (typ): 1.3/1.5/2.5/3.3V
• Mounting: Surface Mount
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

Intel
3.2.11
3.3
3.3.1
3.3.2
68
Table 29. Configuration/GPIO Pins (Sheet 2 of 2)
®
IXP2400 Network Processor
Pin State During Reset
In addition to the configuration pins listed in
TST_RESET_L must always be tied high.
Power Supply Sequencing
Power-Up Sequence
The IXP2400 has the following power supplies:
The power supplies for the IXP2400 should be brought up in a controlled sequence. The delay
between the power-up of the power supplies should be 5 ms or less (min is 50 µs); there is no
dependency between the sequence of the 1.5V and 2.5V power-on.
Power-Down Sequence
All the power supplies should be brought down simultaneously. If the user cannot power down all
the supplies simultaneously, the Power-down sequence is recommended to be the reverse order of
the Power-up sequence shown in
GPIO[6:5]
GPIO[7]
Total (per
channel)
1.
2.
3.
4.
5.
6.
1. The 3.3V must be brought up before the1.3V
2. The 1.3V must be brought up before the 1.5V and 2.5V
3. The 1.5V must be brought up before or at the same time as the 0.75V
4. The 2.5V must be brought up before or at the same time as the 1.25V
Signal Name
VCC3.3
VCC and VCCA
VCC2.5
VCC1.5
D_Vref
Sn_Vref
IO
I/O
CFG_PCI_
SWIN[1:0]
3.3V power supply for the Media Switch Fabric interface, PCI, GPIO,
SlowPort and Misc.
1.3V power supply for the Core and for the PLL
2.5V power supply for the DDR DRAM
1.5V power supply for the QDR SRAM
1.25V for the DDR DRAM
0.75V for QDR SRAM channel 0, and channel 1
Configuration
Function
Section
3.3.1.
Select SRAM BAR Window Size
Not Used
Table
• 11—64 Mbyte
• 10—32 Mbyte
• 01—16 Mbyte
• 00— 8 Mbyte
29, at the deassertion edge of the reset
Description
Datasheet
Number
2
8