AD7686BRMZ Analog Devices Inc, AD7686BRMZ Datasheet - Page 23

• Manufacturer Part Number: AD7686BRMZ
• Description: IC ADC 16BIT 500KSPS 10-MSOP
• Manufacturer: Analog Devices Inc
• Series: PulSAR®r

Specifications of AD7686BRMZ

• Data Interface: DSP, MICROWIRE™, QSPI™, Serial, SPI™
• Number Of Bits: 16
• Sampling Rate (per Second): 500k
• Number Of Converters: 1
• Power Dissipation (max): 21.5mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP (0.118", 3.00mm Width)
• Resolution (bits): 16bit
• Input Channel Type: Pseudo Differential
• Supply Voltage Range - Analogue: 4.5V To 5.5V
• Supply Voltage Range - Digital: 1.8V To 5.8V, 2.3V To 5.8V
• Sampling Rate: 500kSPS
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-AD7686CBZ - BOARD EVALUATION FOR AD7686
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD7686
APPLICATION HINTS
LAYOUT
The printed circuit board (PCB) that houses the AD7686
should be designed so that the analog and digital sections are
separated and confined to certain areas of the board. The
pinout of the AD7686, with all its analog signals on the left side
and all its digital signals on the right side, eases this task.
Avoid running digital lines under the device because doing so
couples noise onto the die, unless a ground plane under the
AD7686 is used as a shield. Fast switching signals, such as CNV
or clocks, should never run near analog signal paths. Crossover
of digital and analog signals should be avoided.
At least one ground plane should be used. It could be common
or split between the digital and analog sections. In the latter
case, the planes should be joined underneath the devices.
Figure 45. Example of Layout of the AD7686 (Top Layer)
The AD7686 voltage reference input REF has a dynamic input
impedance and should be decoupled with minimal parasitic
inductances. This is done by placing the reference decoupling
ceramic capacitor close to, and ideally right up against, the REF
and GND pins and connecting it with wide, low impedance
traces.
Finally, the AD7686 power supplies VDD and VIO should be
decoupled with ceramic capacitors (typically 100 nF) placed
close to the AD7686 and connected using short and wide traces.
This provides low impedance paths and reduces the effect of
glitches on the power supply lines. Examples of layouts that
follow these rules are shown in Figure 45 and Figure 46.
EVALUATING PERFORMANCE
Other recommended layouts for the AD7686 are outlined in
the documentation of the evaluation board (EVAL-AD7686CB).
Figure 46. Example of Layout of the AD7686 (Bottom Layer)
The evaluation board package includes a fully assembled and
tested evaluation board, documentation, and software for
controlling the board from a PC via the universal evaluation
control board
(EVAL-CONTROL
BRD3).
Rev. B | Page 23 of 28