DS1386-8-120+ Maxim Integrated Products, DS1386-8-120+ Datasheet - Page 15

• Manufacturer Part Number: DS1386-8-120+
• Description: IC TIMEKEEPER RAM 64K 32-EDIP
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/NVSRAMr

Specifications of DS1386-8-120+

• Memory Size: 64K (8K x 8)
• Time Format: HH:MM:SS:hh (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 32-DIP Module (600 mil), 32-EDIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NOTES:
1) WE is high for a read cycle.
2) OE = V
3) t
4) t
5) t
6) If the CE low transition occurs simultaneously with or later than the WE low transition in write cycle
7) If the CE high transition occurs prior to or simultaneously with the WE high transition, the output
8) If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition,
9) Each DS1386 is marked with a four-digit date code AABB. AA designates the year of manufacture.
10) All voltages are referenced to ground.
11) Applies to both interrupt pins when the alarms are set to pulse.
12) Interrupt output occurs within 100ns on the alarm condition existing.
13) Both INTA and INTB (INTB) are open-drain outputs.
14) Real-Time Clock modules (DIP) can be successfully processed through conventional wave-soldering
going low to the earlier of CE or
-120 parts and t
1, the output buffers remain in a high impedance state during this period.
buffers remain in a high impedance state during this period.
the output buffers remain in a high impedance state during this period.
BB designates the week of manufacture. The expected t
the date of manufacture.
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85°C. Post solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap module bases experience one pass through
WP
DS
DH
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
or t
solder reflow oriented with the label side up (“live-bug”).
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.
is specified as the logical AND of the CE and WE. t
is measured from WE going high. If CE is used to terminate the write cycle, then t
DH
IH
are measured from the earlier of CE or WE going high.
or V
IL
DH
. If OE = V
= 25ns for -150 parts.
IH
during write cycle, the output buffers remain in a high impedance state.
WE
going high.
15 of 21
DR
WP
is defined for DIP modules as starting at
is measured from the latter of CE or WE
DH
= 20ns for