LFX125EB-04F256I LATTICE SEMICONDUCTOR, LFX125EB-04F256I Datasheet - Page 20

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LFX125EB-04F256I

Manufacturer Part Number
LFX125EB-04F256I
Description
FPGA ispXPGA® Family 139K Gates 1936 Cells EECMOS Technology 2.5V/3.3V 256-Pin FBGA
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet

Specifications of LFX125EB-04F256I

Package
256FBGA
Family Name
ispXPGA®
Device Logic Units
1936
Device System Gates
139000
Number Of Registers
3800
Typical Operating Supply Voltage
2.5|3.3 V
Maximum Number Of User I/os
160
Ram Bits
94208
Re-programmability Support
Yes

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Lattice Semiconductor
The second type of interface implemented is the terminated, single-ended interface standard. This group of inter-
faces includes different versions of SSTL and HSTL interfaces along with CTT, and GTL+. Usage of these particu-
lar I/O interfaces requires an additional V
Typically an output will be terminated to V
The third type of interface standards are the differential standards LVDS, BLVDS, and LVPECL. The differential
standards require two I/O pins to create the differential pair. The logic level is determined by the difference in the
two signals. Table 6 lists how these interface standards are implemented in the ispXPGA devices.
For more information on sysIO capability, refer to TN1000,
Figure 19. sysIO Banks per Device
Table 4. Number of I/Os per Bank
V
V
V
V
CCO0
GND
CCO1
GND
REF0
REF1
XPGA 1200
XPGA 500
XPGA 200
XPGA 125
I/O N
I/O N
I/O 0
I/O 0
Device
REF
TT
Bank 7
Bank 2
at the receiving end of the transmission line it is driving.
signal. At the system level a termination voltage, V
Max. Number of I/Os per Bank (N)
16
sysIO Usage Guidelines for Lattice
Bank 6
Bank 3
62
42
26
22
ispXPGA Family Data Sheet
I/O N
I/O N
I/O 0
I/O 0
V
V
GND
V
V
GND
CCO5
REF5
CCO4
REF4
Devices.
TT
, is also required.

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