MT47H64M16HW-5EL:E Micron Technology Inc, MT47H64M16HW-5EL:E Datasheet - Page 20

• Manufacturer Part Number: MT47H64M16HW-5EL:E
• Manufacturer: Micron Technology Inc

Specifications of MT47H64M16HW-5EL:E

• Lead Free Status / RoHS Status: Not Compliant

Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16
PDF: 09005aef821ae8bf
Rev. O 9/08 EN
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball pads.
84X Ø0.45
11.2 CTR
Seating
plane
0.12 A
0.8 TYP
Note:
0.8 TYP
A
1. All dimensions are in millimeters.
9
8
7
6.4 CTR
8 ±0.15
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.8 ±0.1
20
Exposed
gold-plated pad
1.0mm (MAX) X
0.7mm (NOM)
nonconductive floating pad
12.5 ±0.15
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
1.2 MAX
0.25 MIN
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging