MT47H64M16HW-5EL:E Micron Technology Inc, MT47H64M16HW-5EL:E Datasheet - Page 108
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MT47H64M16HW-5EL:E
Manufacturer Part Number
MT47H64M16HW-5EL:E
Description
Manufacturer
Micron Technology Inc
Datasheet
1.MT47H64M16HW-5ELE.pdf
(135 pages)
Specifications of MT47H64M16HW-5EL:E
Lead Free Status / RoHS Status
Not Compliant
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Figure 57: Consecutive WRITE-to-WRITE
Figure 58: Nonconsecutive WRITE-to-WRITE
PDF: 09005aef821ae8bf
Rev. O 9/08 EN
Notes:
Notes:
t DQSS (NOM)
t DQSS (NOM)
DQS, DQS#
DQS, DQS#
Command
Command
1. Subsequent rising DQS signals must align to the clock within
2. DI b, etc. = data-in for column b, etc.
3. Three subsequent elements of data-in are applied in the programmed order following
4. Three subsequent elements of data-in are applied in the programmed order following
5. Shown with BL = 4, AL = 0, CL = 3; thus, WL = 2.
6. Each WRITE command may be to any bank.
1. Subsequent rising DQS signals must align to the clock within
2. DI b (or n), etc. = data-in for column b (or column n).
3. Three subsequent elements of data-in are applied in the programmed order following
4. Three subsequent elements of data-in are applied in the programmed order following
5. Shown with BL = 4, AL = 0, CL = 3; thus, WL = 2.
6. Each WRITE command may be to any bank.
Address
Address
DI b.
DI n.
DI b.
DI n.
CK#
CK#
DM
DM
DQ
DQ
CK
CK
WRITE
WRITE
Bank,
Bank,
Col b
Col b
T0
T0
WL ±
WL = 2
t CCD
WL = 2
NOP
NOP
T1
T1
t
DQSS
WL ± t DQSS
T1n
108
WRITE
NOP
Bank,
Col n
T2
DI
b
T2
DI
b
T2n
T2n
Micron Technology, Inc. reserves the right to change products or specifications without notice.
WRITE
WL = 2
Bank,
Col n
T3
1
NOP
1
T3
T3n
1Gb: x4, x8, x16 DDR2 SDRAM
T3n
WL = 2
NOP
T4
NOP
T4
1
DI
n
Transitioning Data
Transitioning Data
T4n
T4n
1
NOP
T5
DI
n
NOP
© 2004 Micron Technology, Inc. All rights reserved.
1
T5
t
t
DQSS.
DQSS.
T5n
T5n
NOP
1
T6
NOP
Don’t Care
T6
Don’t Care
T6n
WRITE
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