MT49H32M9BM-25 Micron Technology Inc, MT49H32M9BM-25 Datasheet - Page 2

• Manufacturer Part Number: MT49H32M9BM-25
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H32M9BM-25

• Organization: 32Mx9
• Density: 288Mb
• Address Bus: 22b
• Maximum Clock Rate: 400MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: uBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 779mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Figure 2:
BGA Part Marking Decoder
PDF: 09005aef80a41b59/Source: 09005aef809f284b
288Mb_RLDRAM_II_CIO_D1.fm - Rev N 5/08 EN
288Mb RLDRAM II CIO Part Numbers
Notes:
1. The FBGA package is being phased out.
Due to space limitations, BGA-packaged components have an abbreviated part marking
that is different from the part number. Micron’s BGA Part Marking Decoder is available
on Micron’s Web site at micron.com.
Configuration
32 Meg x 9
16 Meg x 18
8 Meg x 36
288Mb: x9, x18, x36 2.5V V
MT49H
Example Part Number: M T4 9 H 1 6 M1 8 F M - 2 5
16M18
32M9
8M36
Configuration
I/O
Common
Separate
Package
144-ball µBGA
144-ball µBGA (Pb-free)
144-ball FBGA
144-ball FBGA (Pb-free)
2
None
I/O
C
Package
Micron Technology, Inc., reserves the right to change products or specifications without notice.
EXT
-
HU 1
HT 1
BM
FM
Speed Temp
, 1.8V V
Temperature
Commercial
Industrial
Speed Grade
-25
-33
-5
DD
t CK = 2.5ns
t CK = 3.3ns
t CK = 5ns
, HSTL, CIO, RLDRAM II
©2003 Micron Technology, Inc. All rights reserved.
None
IT
Features