MT49H32M9BM-25 Micron Technology Inc, MT49H32M9BM-25 Datasheet - Page 17

• Manufacturer Part Number: MT49H32M9BM-25
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H32M9BM-25

• Organization: 32Mx9
• Density: 288Mb
• Address Bus: 22b
• Maximum Clock Rate: 400MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: uBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 779mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Figure 8:
PDF: 09005aef80a41b59/Source: 09005aef809f284b
288Mb_RLDRAM_II_CIO_D2.fm - Rev N 5/08 EN
DIMENSIONS APPLY TO
SOLDER BALLS POST
REFLOW. THE PRE-REFLOW
BALL IS Ø0.50 ON A Ø0.40
NSMD BALL PAD.
144X
SEATING
17.00
0.10 A
PLANE
144-Ball FBGA
Ø
BALL A12
0.55
Notes:
8.50
A
1. All dimensions are in millimeters.
2. The FBGA package is being phased out.
MOLD
COMPOUND
4.40
288Mb: x9, x18, x36 2.5V V
11.00 ±0.10
2.20 ±0.025
0.80 TYP
CTR
8.80
C L
5.50 ±0.05
9.25 ±0.05
C L
1.00 TYP
0.75 ±0.05
17
BALL A1 ID
BALL A1
0.155 ±0.013
18.50 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
EXT
1.20 MAX
, 1.8V V
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
62% Sn, 36% Pb, 2%Ag OR
96.5% Sn, 3%Ag, 0.5%Cu
DD
, HSTL, CIO, RLDRAM II
Package Dimensions
©2003 Micron Technology, Inc. All rights reserved.
BALL A1 ID