MT28C6428P20FM-80 BET Micron Technology Inc, MT28C6428P20FM-80 BET Datasheet - Page 47

• Manufacturer Part Number: MT28C6428P20FM-80 BET
• Manufacturer: Micron Technology Inc

Specifications of MT28C6428P20FM-80 BET

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

SEATING PLANE
NOTE: 1. All dimensions in millimeters.
DATA SHEET DESIGNATION
No Marking: This data sheet contains minimum and maximum limits specified over the complete power supply
4 Meg x 16 Asynchronous/Page Flash 512K x 16 SRAM Combo Memory
MT28C6428P20_4.p65 – Rev. 4, Pub. 10/02
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.33
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.27mm per side.
5.60
67X ∅0.35
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.
0.12 C
2.80 ±0.05
BALL A12
and temperature range for production devices. Although considered final, these specifications are
subject to change, as further product development and data characterization sometimes occur.
1.05 ±0.075
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
4.40 ±0.05
0.80 (TYP)
11.50 ±0.10
8.80
C L
5.75 ±0.05
4 MEG x 16 ASYNCHRONOUS/PAGE FLASH
67-BALL FBGA
0.80 (TYP)
C L
BALL A1
BALL A1 ID
4.50 ±0.05
47
512K x 16 SRAM COMBO MEMORY
9.00 ±0.10
1.40 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
BALL A1 ID
©2002, Micron Technology, Inc.