TJA1080ATS/1,112 NXP Semiconductors, TJA1080ATS/1,112 Datasheet

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TJA1080ATS/1,112

Manufacturer Part Number
TJA1080ATS/1,112
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TJA1080ATS/1,112

Lead Free Status / RoHS Status
Compliant
1. General description
2. Features
2.1 Optimized for time triggered communication systems
The TJA1080ATS/2 is a FlexRay transceiver that is fully compliant with the FlexRay
electrical physical layer specification V2.1 Rev. A (see
version V2.1 Rev. B. It is primarily intended for communication systems from 1 Mbit/s to
10 Mbit/s, and provides an advanced interface between the protocol controller and the
physical bus in a FlexRay network.
The TJA1080ATS/2 can be configured to be used as an active star transceiver or as a
node transceiver.
The TJA1080ATS/2 provides differential transmit capability to the network and differential
receive capability to the FlexRay controller. It offers excellent EMC performance as well as
high ESD protection.
The TJA1080ATS/2 actively monitors the system performance using dedicated error and
status information (readable by any microcontroller), as well as internal voltage and
temperature monitoring.
The TJA1080ATS/2 supports the mode control as used in NXP Semiconductors TJA1054
(see
The TJA1080ATS/2 is the next step up from the TJA1080 FlexRay transceiver
Being fully pin compatible and offering the same excellent ESD protection, the
TJA1080ATS/2 also features:
This makes the TJA1080ATS/2 an excellent choice in any kind of FlexRay node.
See
TJA1080ATS/2.
I
I
I
I
TJA1080ATS/2
FlexRay transceiver
Rev. 04 — 19 February 2009
Compliant with FlexRay electrical physical layer specification V2.1 Rev. A (see
Automotive product qualification in accordance with AEC-Q100
Data transfer up to 10 Mbit/s
Support of 60 ns minimum bit time
Improved power-on reset concept
Improved ElectroMagnetic Emission (EME)
Support of 60 ns minimum bit time
Improved bus error detection functionality
Section 14
Ref.
2) and TJA1041 (see
for a detailed overview of differences between the TJA1080 and the
Ref.
3) CAN transceivers.
Ref.
1) and partly complies with
Product data sheet
(Ref.
Ref.
4).
1)

Related parts for TJA1080ATS/1,112

TJA1080ATS/1,112 Summary of contents

Page 1

... The TJA1080ATS/2 actively monitors the system performance using dedicated error and status information (readable by any microcontroller), as well as internal voltage and temperature monitoring. The TJA1080ATS/2 supports the mode control as used in NXP Semiconductors TJA1054 (see Ref. The TJA1080ATS/2 is the next step up from the TJA1080 FlexRay transceiver ...

Page 2

... NXP Semiconductors I Very low EME to support unshielded cable I Differential receiver with high common-mode range for ElectroMagnetic Immunity (EMI) I Auto I/O level adaptation to host controller supply voltage V I Usable for 14 V and 42 V powered systems I Bus guardian interface included I Independent power supply ramp-up for V ...

Page 3

... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Name Description TJA1080ATS/2 SSOP20 plastic shrink small outline package; 20 leads; body width 5.3 mm TJA1080A_4 Product data sheet Rev. 04 — 19 February 2009 TJA1080ATS/2 FlexRay transceiver Version SOT339-1 © NXP B.V. 2009. All rights reserved. ...

Page 4

... NXP Semiconductors 4. Block diagram TRXD0 10 TRXD1 TXD 6 TXEN 8 BGE 9 STBN RXD 13 ERRN 12 RXEN V BAT 15 WAKE Fig 1. Block diagram TJA1080A_4 Product data sheet TJA1080ATS/2 SIGNAL ROUTER INPUT VOLTAGE ADAPTATION RXDINT OUTPUT VOLTAGE STATE ADAPTATION MACHINE WAKE-UP DETECTION OSCILLATOR UNDERVOLTAGE DETECTION 16 GND Rev. 04 — 19 February 2009 ...

Page 5

... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 2. 5.2 Pin description Table 2. Symbol Pin INH2 INH1 TXD TXEN RXD BGE STBN TRXD1 TRXD0 RXEN ERRN V BAT WAKE GND BUF TJA1080A_4 Product data sheet 1 INH2 INH1 TXD TJA1080ATS/2 TXEN 6 RXD 7 8 BGE STBN ...

Page 6

... NXP Semiconductors 6. Functional description The block diagram of the total transceiver is illustrated in 6.1 Operating configurations 6.1.1 Node configuration In node configuration the transceiver operates as a stand-alone transceiver. The transceiver can be configured as node by connecting pins TRXD0 and TRXD1 to ground during a power-on situation (PWON flag is set). The configuration will be latched when the PWON fl ...

Page 7

... NXP Semiconductors 6.1.3 Bus activity and idle detection The following mechanisms for activity and idle detection are valid for node and star configurations in normal power modes: • If the absolute differential voltage on the bus lines is higher than V t det(act)(bus) which results in pin RXD being released: – ...

Page 8

... NXP Semiconductors TXD BGE TXEN BP BM RXEN RXD Fig 3. Timing diagram in Normal mode node configuration STBN EN ERRN Fig 4. Timing diagram of control pins EN and STBN The state diagram in node configuration is illustrated in TJA1080A_4 Product data sheet receive normal only standby 0. ...

Page 9

... NXP Semiconductors RECEIVE ONLY STBN = HIGH 15, 25, 42 17, 39 31, 32 STANDBY STBN = LOW 19 (1) At the first battery connection the transceiver will enter the Standby mode. Fig 5. State diagram in node configuration The state transitions are represented with numbers, which correspond with the numbers ...

Page 10

Table 4. State transitions forced by EN and STBN (node configuration) indicates the action that initiates a transaction; Transition Direction to Transition Pin from mode mode number STBN Normal Receive-only 1 H Go-to-sleep 2 L Standby 3 L Receive-only Normal ...

Page 11

Table 5. State transitions forced by a wake-up (node configuration) indicates the action that initiates a transaction; Transition Direction to Transition Pin from mode mode number STBN Standby Normal 16 H Receive-only 17 H Go-to-sleep 18 L Standby 19 L ...

Page 12

Table 6. State transitions forced by an undervoltage condition (node configuration) indicates the action that initiates a transaction; Transition from Direction to Transition mode mode number Normal Sleep 28 Sleep 29 Standby 30 Receive-only Sleep 31 Sleep 32 Standby 33 ...

Page 13

Table 7. State transitions forced by an undervoltage recovery (node configuration) indicates the action that initiates a transaction; Transition Direction to Transition Pin from mode mode number STBN Standby Normal 38 H Receive-only 39 H Sleep Normal 40 H Normal ...

Page 14

... NXP Semiconductors 6.2.1 Normal mode In Normal mode the transceiver is able to transmit and receive data via the bus lines BP and BM. The output of the normal receiver is directly connected to pin RXD. The transmitter behavior in Normal mode of operation, with no time-out present on pins TXEN and BGE and the temperature flag not set, is given in In this mode pins INH1 and INH2 are set HIGH ...

Page 15

... NXP Semiconductors 6.2.5 Sleep mode In Sleep mode the transceiver has entered a low power mode. The only difference with Standby mode is that pin INH1 is also set floating. Sleep mode is also entered if the VBAT In case of an undervoltage on pin V a positive edge on pin STBN. ...

Page 16

... NXP Semiconductors TXEN activity detected for longer than t STAR TRANSMIT INH1 = HIGH INH2 = HIGH TXEN activity detected time in star locked longer than t to(locked-sleep) STAR SLEEP INH1 = floating INH2 = floating from any mode if UV VCC flag is set regardless PWON flag (1) At the first battery connection the transceiver will enter the Star-standby mode. ...

Page 17

... NXP Semiconductors star transmit TRXD0 TRXD1 TXEN TXD TRXDOUT BP BM RXEN RXD TRXDOUT is a virtual signal that indicates the state of the TRXD lines. TRXDOUT HIGH means TRXD lines switched as output. TRXDOUT LOW means TRXD lines switched as input. Fig 7. Timing diagram in star configuration 6 ...

Page 18

... NXP Semiconductors 6.3.2 Star-transmit mode This mode is entered if one of the following events occur: • If the transceiver is in Star-idle mode and activity is detected on pin TXEN. • If the transceiver is in Star-idle mode and activity is detected on pins TRXD0 and TRXD1. In Star-transmit mode the transmitter is enabled and the transceiver can transmit data on the bus lines and on the TRXD lines ...

Page 19

... NXP Semiconductors 6.3.5 Star-sleep mode This mode is entered if one of the following events occur: • From any mode if an undervoltage on pin V • If the transceiver is in Star-idle mode and no activity is detected on the bus lines and pins TXEN, TRXD0 and TRXD1 for longer than t • ...

Page 20

... NXP Semiconductors 6.5 Wake-up mechanism 6.5.1 Node configuration In Sleep mode (pins INH1 and INH2 are switched off), the transceiver will enter Standby mode or Go-to-sleep mode (depending on the value at pin EN), if the wake flag is set. Consequently, pins INH1 and INH2 are switched on. ...

Page 21

... NXP Semiconductors V dif 130 ns +1500 0 V 1500 770 870 870 Each interruption is 130 ns. The transition time from Data_0 to Data_1 and from Data_1 to Data_0 is about 20 ns. The TJA1080ATS/2 wake-up flag will be set with the following pattern: FFh, FFh, FFh, FFh, FFh, 00h, 00h, 00h, 00h, 00h, ...

Page 22

... NXP Semiconductors 6.6 Fail silent behavior In order to be fail silent, undervoltage detection and a reset mechanism for the digital state machine is implemented undervoltage is detected on pins V low power mode. This ensures a passive and defined behavior of the transmitter and receiver in case of an undervoltage detection. ...

Page 23

... NXP Semiconductors • Star configuration undervoltage is present on pin V reset) pins EN, STBN, TXD and BGE are set LOW (internally) and pin TXEN is set HIGH (internally). If the UV is present on pin V forward the received data on TRXD or bus lines to all other branches. 6.7 Flags 6.7.1 Local wake-up source fl ...

Page 24

... NXP Semiconductors 6.7.7 Temperature high flag The temperature high flag is set if the junction temperature exceeds T power mode while pin V In node configuration the temperature high flag is reset if a negative edge is applied to pin TXEN while the junction temperature is lower than T pin V ...

Page 25

... NXP Semiconductors 6.8 TRXD collision A TRXD collision is detected when both TRXD lines are LOW for more than the TRXD collision detection time (t 6.9 Status register The status register can be read out on pin ERRN by using pin EN as clock; the status bits are given in The status register is accessible if: • ...

Page 26

... NXP Semiconductors STBN EN ERRN Fig 11. Timing diagram for status bits TJA1080A_4 Product data sheet normal 0. d(EN-ERRN) 0. 0.3V IO Rev. 04 — 19 February 2009 TJA1080ATS/2 FlexRay transceiver receive only 0. det(EN 001aag896 © NXP B.V. 2009. All rights reserved ...

Page 27

... NXP Semiconductors 7. Limiting values Table 11. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter V supply voltage on pin V BAT V supply voltage CC V supply voltage on pin V BUF V supply voltage on pin voltage on pin INH1 INH1 ...

Page 28

... NXP Semiconductors [5] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature T fixed value to be used for the calculation of T temperature (T ). amb [6] HBM 100 pF 1 [7] HBM 100 pF 1 [8] MM 200 pF 0. [9] CDM Thermal characteristics Table 12. Thermal characteristics Symbol Parameter R thermal resistance from junction to ambient th(j-a) 9 ...

Page 29

... NXP Semiconductors Table 13. Static characteristics All parameters are guaranteed for +150 bus ground; positive currents flow into the IC. Symbol Parameter V undervoltage detection uvd(VIO) voltage on pin undervoltage recovery uvr(VIO) voltage on pin undervoltage hysteresis uvhys(VIO) voltage on pin V IO Pin V BUF I supply current on pin ...

Page 30

... NXP Semiconductors Table 13. Static characteristics All parameters are guaranteed for +150 bus ground; positive currents flow into the IC. Symbol Parameter Pin STBN V HIGH-level input voltage IH(STBN) on pin STBN V LOW-level input voltage IL(STBN) on pin STBN I HIGH-level input current IH(STBN) on pin STBN I LOW-level input current ...

Page 31

... NXP Semiconductors Table 13. Static characteristics All parameters are guaranteed for +150 bus ground; positive currents flow into the IC. Symbol Parameter Pin RXD I HIGH-level output current OH(RXD) on pin RXD I LOW-level output current OL(RXD) on pin RXD Pin ERRN I HIGH-level output current OH(ERRN) on pin ERRN ...

Page 32

... NXP Semiconductors Table 13. Static characteristics All parameters are guaranteed for +150 bus ground; positive currents flow into the IC. Symbol Parameter V idle output voltage on pin o(idle)(BM idle output current on pin o(idle) idle output current on pin o(idle) differential idle output o(idle)(dif) voltage ...

Page 33

... NXP Semiconductors Table 13. Static characteristics All parameters are guaranteed for +150 bus ground; positive currents flow into the IC. Symbol Parameter I input leakage current on LI(BM) pin BM V DATA_0 bus cm(bus)(DATA_0) common-mode voltage V DATA_1 bus cm(bus)(DATA_1) common-mode voltage V bus common-mode cm(bus) ...

Page 34

... NXP Semiconductors Table 13. Static characteristics All parameters are guaranteed for +150 bus ground; positive currents flow into the IC. Symbol Parameter Power-on reset V power-on reset detection th(det)POR threshold voltage V power-on reset recovery th(rec)POR threshold voltage V power-on reset hysteresis hys(POR) voltage [1] Current flows from ...

Page 35

... NXP Semiconductors Table 14. Dynamic characteristics All parameters are guaranteed for +150 bus ground; positive currents flow into the IC. Symbol Parameter t delay time difference from bus to d(bus-TRXD) TRXD t delay time from TXEN to bus idle Normal mode d(TXEN-busidle) t delay time from TXEN to bus ...

Page 36

... NXP Semiconductors Table 14. Dynamic characteristics All parameters are guaranteed for +150 bus ground; positive currents flow into the IC. Symbol Parameter t idle to sleep time-out time to(idle-sleep) t transmit to locked time-out time to(tx-locked) t receive to locked time-out time to(rx-locked) t locked to sleep time-out time to(locked-sleep) t locked to idle time-out time ...

Page 37

IO TXD 0.3V IO 0.7V IO TXEN 0.3V IO 0.7V IO BGE 0.3V IO +300 mV BP and 300 mV 0.7V IO RXEN 0.3V IO 0.7V IO RXD 0. ...

Page 38

... NXP Semiconductors Fig 13. Receiver test signal TJA1080A_4 Product data sheet V dif (mV) 22.5 ns 400 300 300 400 t d(bus-RXD) RXD V dif (mV) 22.5 ns 400 300 300 400 t d(bus-RXD) RXD V is the receiver test signal. dif Rev. 04 — 19 February 2009 TJA1080ATS/2 FlexRay transceiver 22.5 ns 37.5 ns ...

Page 39

... NXP Semiconductors 11. Test information Fig 14. Test circuit for dynamic characteristics Fig 15. Test circuit for automotive transients TJA1080A_4 Product data sheet + 100 TJA1080ATS 100 BAT TJA1080ATS/2 The waveforms of the applied transients are in accordance with ISO 7637, test pulses 1, 2, 3a, 3b, 4 and 5. Test conditions: Normal mode: bus idle Normal mode: bus active ...

Page 40

... NXP Semiconductors 12. Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT339-1 Fig 16 ...

Page 41

... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...

Page 42

... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...

Page 43

... NXP Semiconductors Fig 17. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Appendix 14.1 Differences between TJA1080 and TJA1080ATS/2 14.1.1 Start-up Table 17. TJA1080 At power- reaches 6 BAT ...

Page 44

... NXP Semiconductors 14.1.2 Bus error detection Table 18. TJA1080 The TJA1080 expects that a data frame begins with a bit value other than the last bit of the previous data frame. This is the case for a valid data frame which begins with the DATA_0 period of the ...

Page 45

... NXP Semiconductors 15. Abbreviations Table 22. Abbreviation BSS CAN CDM EMC EME EMI ESD FES HBM MM PWON TSS 16. References [1] EPL — FlexRay Communications System Electrical Physical Layer Specification Version 2.1 Rev. A, FlexRay Consortium, Dec. 2005 [2] PS54 — Product specification: TJA1054; Fault-tolerant CAN transceiver, www ...

Page 46

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 47

... NXP Semiconductors 19. Contact information For more information, please visit: For sales office addresses, please send an email to: TJA1080A_4 Product data sheet http://www.nxp.com salesaddresses@nxp.com Rev. 04 — 19 February 2009 TJA1080ATS/2 FlexRay transceiver © NXP B.V. 2009. All rights reserved ...

Page 48

... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 Optimized for time triggered communication systems 2.2 Low power management . . . . . . . . . . . . . . . . . 2 2.3 Diagnosis (detection and signalling 2.4 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.5 Functional classes according to FlexRay electrical physical layer specification (see Ref Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Pinning information ...

Page 49

... NXP Semiconductors 19 Contact information Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 TJA1080ATS/2 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com FlexRay transceiver All rights reserved ...

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