BLF6G20-45 /T3 NXP Semiconductors, BLF6G20-45 /T3 Datasheet - Page 6

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BLF6G20-45 /T3

Manufacturer Part Number
BLF6G20-45 /T3
Description
RF MOSFET Small Signal LDMOS TNS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF6G20-45 /T3

Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.2 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
13 V
Continuous Drain Current
13 A
Maximum Operating Temperature
+ 225 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Package / Case
CDFM
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
65V
Output Power (max)
2.5W(Typ)
Power Gain (typ)@vds
19.2@28VdB
Frequency (min)
1.805GHz
Frequency (max)
2GHz
Package Type
CDFM
Pin Count
3
Forward Transconductance (typ)
5S
Drain Source Resistance (max)
200(Typ)@6.15Vmohm
Operating Temp Range
-65C to 225C
Drain Efficiency (typ)
14%
Mounting
Screw
Mode Of Operation
2-Carrier W-CDMA
Number Of Elements
1
Vswr (max)
10
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF6G20-45,135
NXP Semiconductors
BLF6G20-45_BLF6G20S-45_2
Product data sheet
Fig 7.
Striplines are on a double copper-clad Rogers Duroid 5880 Printed-Circuit Board (PCB) (
See
Component layout for 1805 MHz and 1880 MHz test circuit
C4
Table 8
C3
C5
R1 C6
for list of components.
C1
Rev. 02 — 25 August 2008
C2
BLF6G20-45; BLF6G20S-45
r
= 2.2), thickness = 0.79 mm.
C8 C10
C9
Power LDMOS transistor
C11
C7
C14
C12
© NXP B.V. 2008. All rights reserved.
C15
C13
001aah551
C16
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