CY7C1347G-200AXC Cypress Semiconductor Corp, CY7C1347G-200AXC Datasheet - Page 12

SRAM (Static RAM)

CY7C1347G-200AXC

Manufacturer Part Number
CY7C1347G-200AXC
Description
SRAM (Static RAM)
Manufacturer
Cypress Semiconductor Corp
Datasheets

Specifications of CY7C1347G-200AXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
4.5M (128K x 36)
Speed
200MHz
Interface
Parallel
Voltage - Supply
3.15 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Density
4.5Mb
Access Time (max)
2.8ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
200MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
17b
Package Type
TQFP
Operating Temp Range
0C to 70C
Number Of Ports
4
Supply Current
265mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
128K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
428-2115
CY7C1347G-200AXC

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1347G-200AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1347G-200AXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Company:
Part Number:
CY7C1347G-200AXC
Quantity:
360
Part Number:
CY7C1347G-200AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05516 Rev. *H
C
C
C
Parameter
Parameter
IN
CLK
IO
Θ
OUTPUT
OUTPUT
Θ
JA
JC
3.3-V I/O Test Load
2.5-V I/O Test Load
Input capacitance
Clock input capacitance
I/O capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Z
Z
0
0
Description
Description
= 50 Ω
= 50 Ω
V
(a)
(a)
V
T
T
= 1.5 V
= 1.25 V
R
R
L
L
= 50 Ω
= 50 Ω
T
V
V
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
A
DD
DDQ
OUTPUT
OUTPUT
= 25 °C, f = 1 MHz,
3.3 V
2.5 V
Figure 4. AC Test Loads and Waveforms
= 3.3 V.
= 3.3 V
Test Conditions
Test Conditions
Including
JIG and
Including
scope
JIG and
scope
5 pF
5 pF
(b)
(b)
R = 317 Ω
R = 1667 Ω
R = 351 Ω
R = 1538 Ω
100 TQFP
100 TQFP
Package
V
30.32
6.85
GND
GND
Max
V
DDQ
DDQ
5
5
5
≤ 1 ns
≤ 1 ns
10%
10%
119 BGA
119 BGA
Package
Max
34.1
14.0
All input pulses
All input pulses
5
5
7
90%
90%
(c)
(c)
165 FBGA
165 FBGA
Package
CY7C1347G
Max
20.3
4.6
5
5
7
90%
90%
Page 12 of 23
10%
10%
≤ 1 ns
≤ 1 ns
°C/W
°C/W
Unit
Unit
pF
pF
pF
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