BGB 717L7ESD E6327 Infineon Technologies, BGB 717L7ESD E6327 Datasheet
BGB 717L7ESD E6327
Specifications of BGB 717L7ESD E6327
Related parts for BGB 717L7ESD E6327
BGB 717L7ESD E6327 Summary of contents
Page 1
SiGe:C Low Noise Amplifier MMIC for FM Radio Applications Revision 3.3, 2010-06- & ...
Page 2
... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life ...
Page 3
... Converted to the new IFX Template. Revision 3.2 Supply Voltage limited to 4.0 V Trademarks of Infineon Technologies AG BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™ ...
Page 4
Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 5
List of Figures Figure 1 Pinning of BGB717L7ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 6
List of Tables Table 1 Pinning Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 7
SiGe:C Low Noise Amplifier MMIC for FM Radio Applications 1 Features Main features: • High performance FM radio LNA with integrated biasing • Worldwide FM band support (76 MHz to 108 MHz) • Integrated ESD protection for all pins (3 ...
Page 8
... FM antenna systems requiring high gain, reduced power consumption and very low distortion. The external components determine the gain of the FM amplifier and can also be modified to extend the operating frequency. The device is based upon Infineon Technologies cost effective SiGe:C technology and comes in a low profile TSLP-7-1 leadless green package. Figure 1 ...
Page 9
Maximum Ratings Table 2 Maximum Ratings at Parameter Supply voltage T = -55°C A Supply current at VCC pin IDC current at RF-In Pin Control On / Off voltage 1) Total power dissipation 2) T ≤ 112 °C S ...
Page 10
Thermal Characteristics Table 3 Thermal Resistance Parameter 1) Junction - soldering point R 1) For calculation of please refer to Application Note Thermal Resistance thJA Figure 2 Total Power Dissipation 5 Operation Conditions Table 4 Operation Conditions Parameter Supply ...
Page 11
Electrical Characteristics 6.1 DC Characteristics Table 5 DC Characteristics at Parameter Supply current Supply current in Off mode Current into Ctrl On/Off pin in On mode Current into Ctrl On/Off pin in Off mode 6.2 AC Characteristics This section ...
Page 12
Table 6 Bill of Material Component Value C 330 330 Ω Ω 470 nH 1 The following table gives an ...
Page 13
Package Information Top view Pin 1 marking 1) Dimension applies to plated terminal Figure 4 Package Outline TSLP-7-1 (bottom view 1.4 0.3 0.3 0.3 Copper Solder mask Figure 5 Footprint TSLP-7-1 Figure 6 Marking of TSLP-7-1 ...
Page 14
... Published by Infineon Technologies AG ...