SI4313-B1-FM Silicon Laboratories Inc, SI4313-B1-FM Datasheet - Page 47

IC RX FSK 315-915MHZ 20VQFN

SI4313-B1-FM

Manufacturer Part Number
SI4313-B1-FM
Description
IC RX FSK 315-915MHZ 20VQFN
Manufacturer
Silicon Laboratories Inc
Series
EZRadio®r
Type
ISM Receiverr
Datasheets

Specifications of SI4313-B1-FM

Package / Case
20-VQFN
Mfg Application Notes
Si4313 Register Desc AppNote
Frequency
315MHz, 434MHz, 868MHz, 915MHz
Sensitivity
-118dBm
Data Rate - Maximum
128kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
Data Logging, Health Monitors, Remote Control, Weather Station
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Voltage - Supply
1.8 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Operating Frequency
315 MHz to 915 MHz
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Current
100 nA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Memory Size
-
Current - Receiving
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1980-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI4313-B1-FM
Quantity:
2
Part Number:
SI4313-B1-FMR
Manufacturer:
TI
Quantity:
10 000
Part Number:
SI4313-B1-FMR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for the
7. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
between the solder mask and the metal pad is to be 60 µm minimum, all
the way around the pad.
walls should be used to assure good solder paste release.
perimeter pads.
used for the center ground pad.
specification for small body components.
Symbol
C1
C2
X1
X2
Y1
Y2
E
Table 18. PCB Land Pattern Dimensions
Rev. 1.0
3.90
3.90
0.20
2.65
0.65
2.65
Min
Millimeters
0.50 REF
Max
4.00
4.00
0.30
2.75
0.75
2.75
Si4313-B1
47

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