TDA9899HN/V2,551 NXP Semiconductors, TDA9899HN/V2,551 Datasheet
TDA9899HN/V2,551
Specifications of TDA9899HN/V2,551
TDA9899HN/V2-S
TDA9899HN/V2-S
Related parts for TDA9899HN/V2,551
TDA9899HN/V2,551 Summary of contents
Page 1
TDA9899 Multistandard hybrid IF processing including car mobile Rev. 03 — 15 January 2008 1. General description The Integrated Circuit (IC) is suitable for Intermediate Frequency (IF) processing including global multistandard Analog TV (ATV), Digital Video Broadcast (DVB) and mono ...
Page 2
... NXP Semiconductors I VIF Automatic Gain Control (AGC) detector for gain control; operating as a peak sync detector for negative modulated signals and as a peak white detector for positive modulated signals I Optimized AGC modes for negative modulation; e.g. very fast reaction time for VIF and ...
Page 3
... NXP Semiconductors I TAGC operating as peak detector, fast reaction time due to additional speed-up detector I Port function I TAGC voltage monitor output 2.4 Dual mode I Fully performed DTV processing and additional ATV video signal processing in parallel, but with reduced performance, for very fast channel scan ...
Page 4
... NXP Semiconductors Table 1. Quick reference data amb Symbol Parameter V peak-to-peak video output voltage o(video)(p-p) G differential gain dif differential phase dif video bandwidth video( 3dB) first sound carrier attenuation SC1 (S/N) weighted signal-to-noise ratio w PSRR power supply ripple rejection on CVBS pin CVBS ...
Page 5
... NXP Semiconductors Table 1. Quick reference data amb Symbol Parameter f AF cut-off frequency 3dB(AF) (S/N) AF weighted signal-to-noise ratio w(AF) PSRR power supply ripple rejection V RMS output voltage o(RMS) FM sound part V RMS FM input voltage i(FM)(RMS change of AFC current with RIF AFC RIF ...
Page 6
... NXP Semiconductors Table 1. Quick reference data amb Symbol Parameter G maximum IF gain IF(max) G control range IF gain IF(cr) f synthesizer frequency synth synthesizer phase noise n(synth) low IF pass-band ripple ripple(pb)LIF stop-band attenuation stpb image rejection image C/N carrier-to-noise ratio Digital zero IF V peak-to-peak differential output ...
Page 7
... NXP Semiconductors [4] Condition: luminance range (5 steps) from 100 %. Measurement value is based steps. Measurement using 200 kHz high-pass filter, 5 MHz low-pass filter and subcarrier notch filter ( “ITU-T J.64” ). [5] [6] To match the AFC output signal to different tuning systems a current output is provided. The test circuit is given in AFC steepness can be changed by resistors R1 and R2 ...
Page 8
... NXP Semiconductors 6. Block diagram SDA SCL 23 24 TDA9899 36 AGCDIN 3 IF3A 4 IF3B 6 IF1A 7 IF1B 2 9 IF2A 10 IF2B CIFAGC 5 45 AGCVIN DECODER PEAK AGC TUNER 47 TAGC 48 GND Fig 1. Block diagram of TDA9899 (continued in TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile i.c. ...
Page 9
... NXP Semiconductors V GNDA P 43, 44 40, 41 SUPPLY TDA9899 BAND-PASS FILTER (1) Optional. (2) Connect resistor if input or crystal is not used. Fig 2. Block diagram of TDA9899 (continued from TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile R (2) EXTERNAL SOUND (1) BAND-PASS FILTER EXTFILO EXTFILI on/off FM switch ...
Page 10
... NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 3. Pin configuration for LQFP48 TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile LFSYN2 1 n.c. 2 IF3A 3 IF3B 4 CIFAGC 5 IF1A 6 TDA9899HL IF1B 7 CTAGC 8 IF2A 9 IF2B 10 TOP2 11 MPP1 12 Rev. 03 — 15 January 2008 TDA9899 36 AGCDIN ...
Page 11
... NXP Semiconductors Fig 4. Pin configuration for HVQFN48 7.2 Pin description Table 3. Symbol LFSYN2 n.c. IF3A IF3B CIFAGC IF1A IF1B CTAGC IF2A IF2B TOP2 MPP1 LFVIF i.c. EXTFILO MPP2 EXTFILI TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile terminal 1 ...
Page 12
... NXP Semiconductors Table 3. Symbol i.c. LFFM CDEEM EXTFMI GNDD SDA SCL ADRSEL OUT1A OUT1B CAF OUT2A OUT2B AUD BVS CVBS APCHC APCLC AGCDIN AGCSWI LFSYN1 OPTXTAL GNDA GNDA DIV AGCVIN FREF TAGC GND 8. Functional description 8.1 IF input switch Different signal bandwidth can be handled by using two signal processing chains with individual gain control. Switch confi ...
Page 13
... NXP Semiconductors The switch takes into account correct signal selection for TAGC in the event of VIF and DIF signal processing. 8.2 VIF demodulator ATV demodulation using 6 MHz DVB window (band-pass) filter (for 6 MHz, 7 MHz or 8 MHz channel width). IF frequencies adapted to enable the use of different filter configurations. The Nyquist processing is integrated. For optional use of standard Nyquist fi ...
Page 14
... NXP Semiconductors 8.3.4 Tuner AGC Independent integral tuner gain control loop (not nested with VIF AGC). Integral characteristic provides high control accuracy. Accurate setting of tuner control onset (TOP) for integral tuner gain control loop via 2 I C-bus. For L standard, TAGC remains VIF AGC nested, as from field experience in the past this narrow-band TAGC gives best performance ...
Page 15
... NXP Semiconductors 8.6 DIF/SIF converter stage Frequency conversion with sideband suppression. Selection mode of upper or lower sideband for pass or suppression. Suppression around zero for frequency conversion. I/Q output mode for zero IF conversion. Conversion mode selection via synthesizer for DIF, TSS and radio mode or via VIF Frequency Phase-Locked Loop (FPLL) for TV QSS sound (FM/AM). External BP fi ...
Page 16
... NXP Semiconductors Output amplifier for AM sound. 8.9 Synthesizer In DIF mode, the synthesizer supports low and zero IF input frequencies for 34.5 MHz, 36 MHz, 44 MHz and 57 MHz center frequencies. In TSS and radio mode, the synthesizer supports 2nd sound intercarrier conversion. A large set of synthesizer frequencies in steps of 0.5 MHz enables flexible combination of fi ...
Page 17
... NXP Semiconductors 9.1 Read format S Fig 5. I Table 6. 7 AFCWIN Table 7. Bit [ input is applied, then bit AFCWIN can be logic 1 due to the fact that the VCO is forced to the AFC window border for fast lock-in behavior. [2] All standards except M/N standard. [3] M/N standard. ...
Page 18
... NXP Semiconductors Table 8. Bit AFC4 R1[ [1] f nom [2] In ATV mode f means vision intermediate frequency; in radio mode f means radio intermediate frequency. Table 9. 7 reserved Table 10. Bit TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile Automatic frequency control bits AFC3 AFC2 ...
Page 19
... NXP Semiconductors Table 11. Bit VAGC5 R2[ TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile AGC bits (for corresponding AGC characteristic see VAGC4 VAGC3 VAGC2 R2[4] R2[3] R2[ Rev. 03 — 15 January 2008 TDA9899 Figure 10) Typical V AGC(VIF) VAGC1 VAGC0 (V) R2[1] R2[ (TOP 0. 0. 0.12 ...
Page 20
... NXP Semiconductors Table 11. Bit VAGC5 R2[ [1] The reference of 0 (TOP) can be adjusted via TOPPOS[4:0] (register W10; see via potentiometer at pin TOP2. 9.2 Write format S BYTE R/W slave address 0 from master to slave from slave to master 2 Fig 6. I C-bus write format (slave receives data) ...
Page 21
... NXP Semiconductors 9.2.1 Subaddress Table 12 Table 13. Bit Table 14. Bit Table 15. I C-bus write register overview Register 7 6 [2] W1 RADIO STD1 [3] W2 MOD STD4 [4] W3 RESCAR AMUTE [5] W4 VIFLEVEL BP [6] W5 FSFREQ1 FSFREQ0 [7] W6 TAGC1 TAGC0 [8] W7 FREFOUT WAFP [ [10] W9 DAGCSLOPE TAGCIS [11] ...
Page 22
... NXP Semiconductors [8] See Table 43 for detailed description of W7. [9] See Table 45for detailed description of W8. [10] See Table 48 for detailed description of W9. [11] See Table 51 for detailed description of W10. 9.2.2 Description of data bytes Table 16 data write register bit allocation 7 6 RADIO STD1 Table 17. ...
Page 23
... NXP Semiconductors Table 19. Intercarrier sound BP and FM PLL frequency select for ATV, TSS mode Bit RADIO MOD STD1 W1[7] W2[7] W1[ [1] For description of bit MOD refer to Table 20. Intercarrier sound BP and FM PLL frequency select for radio, QSS mode Bit RADIO MOD STD1 W1[7] ...
Page 24
... NXP Semiconductors W7 Fig 7. Signal path for intercarrier (2nd SIF) processing Table 23. Bit TV2 W1[ TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile BYPASS BAND-PASS W7 external filter output external filter input 3 dB EXTFILI EXTFILO Dual mode options Output mode TV1 DIRECT DUAL ...
Page 25
... NXP Semiconductors Table 24. 7 MOD Table 25. Bit Table 26. Bit NYQOFF W7[ TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile W2 - data write register bit allocation STD4 STD3 STD2 W2 - data write register bit description Symbol Description MOD modulation 1 = negative; FM mono sound at ATV and dual mode 0 = positive ...
Page 26
... NXP Semiconductors Table 27. Bit MOD W2[ Table 28. 7 RESCAR Table 29. Bit and 0 TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile VIF PLL gating and detector mode Gating and detector mode PLL W2[ gating in positive modulation mode (W2[ gating in positive modulation mode (W2[ mode on ...
Page 27
... NXP Semiconductors Table 30. 7 VIFLEVEL Table 31. Bit and and 1 0 TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile W4 - data write register bit allocation MPP2S1 MPP2S0 W4 - data write register bit description Symbol Description VIFLEVEL control of internal VIF mixer input level (W1[ and OUT1/OUT2 output level ...
Page 28
... NXP Semiconductors Table 32. Bit TV2 W1[ [1] Intercarrier output level based on wide-band AGC of SIF amplifier. [2] SIF output level based on wide-band AGC of SIF amplifier. [3] Intercarrier output level based on narrow-band AGC of FM amplifier. Table 33. Bit WAFP W7[ Table 34. W4[3] (AGCSW TDA9899_3 Product data sheet ...
Page 29
... NXP Semiconductors Table 35. 7 FSFREQ1 FSFREQ0 Table 36. Bit 7 and [1] For bit description of TV1 and TV2 see TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile W5 - data write register bit allocation SFREQ5 SFREQ4 W5 - data write register bit description Symbol Description FSFREQ[1:0] DTV fi ...
Page 30
... NXP Semiconductors Table 37. Bit SFREQ5 W5[ TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile DIF/SIF synthesizer frequencies (using bit TWOFLO = 0) SFREQ4 SFREQ3 SFREQ2 W5[4] W5[3] W5[ Rev. 03 — 15 January 2008 TDA9899 f synth SFREQ1 SFREQ0 W5[1] W5 26.5 ...
Page 31
... NXP Semiconductors Table 37. Bit SFREQ5 W5[ Table 38. Bit SFREQ5 W5[5] 1 TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile DIF/SIF synthesizer frequencies (using bit TWOFLO = 0) SFREQ4 SFREQ3 SFREQ2 W5[4] W5[3] W5[ DIF/SIF synthesizer frequency for zero IF Japan (using bit TWOFLO = 1) SFREQ4 SFREQ3 ...
Page 32
... NXP Semiconductors Table 39. 7 TAGC1 Table 40. Bit 7 and 6 5 and [1] In integral TAGC loop mode the pin TAGC provides sink and source currents for control. TakeOver Point (TOP) is set via register W9 TOPNEG[4:0]. [2] For bit description refer to Table 41. Bit AGC2 W6[ [1] For bit description of MOD refer to ...
Page 33
... NXP Semiconductors Table 42. 7 FREFOUT Table 43. Bit [1] Pin OPTXTAL wired as quartz oscillator or used as reference frequency input. Table 44 Table 45. Bit TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile W7 - data write register bit allocation WAFP SIFLEVEL VIDLEVEL OPSTATE W7 - data write register bit description ...
Page 34
... NXP Semiconductors Table 46. Easy setting (to be used for fixed bit set-up only) Bit EASY3 EASY2 EASY1 W8[3] W8[2] W8[ [1] Access to register after selection of an easy setting mode would require a transfer of all register data. Table 47 data write register bit allocation 7 6 DAGCSLOPE TAGCIS Table 48 ...
Page 35
... NXP Semiconductors Table 49. Bit TOPNEG4 W9[ [1] See Table 50 Table 51. Bit 7 and Table 52. Bit TOPPOS4 W10[ [1] See TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile Tuner takeover point adjustment bits W9[4:0] TOPNEG3 TOPNEG2 W9[3] W9[ Table 55 for parameter tuner takeover point accuracy ( ...
Page 36
... NXP Semiconductors 10. Limiting values Table 53. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg T amb T case V esd [1] Class 2 according to JESD22-A114. [2] Class B according to EIA/JESD22-A115. 11. Thermal characteristics Table 54. Symbol R th(j-a) R th(j-c) 12. Characteristics 12.1 Analog TV signal processing Table 55. Characteristics see Table 26 ...
Page 37
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 38
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 39
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 40
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 41
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 42
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 43
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 44
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 45
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 46
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 47
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 48
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 49
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 50
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 51
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 52
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 53
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 54
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 55
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 56
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 57
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 58
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 59
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 60
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 61
... NXP Semiconductors Table 55. Characteristics …continued see Table 26 P amb f = 32.875 MHz dB for L); IF input from 50 via broadband transformer video modulation: Vestigial SideBand (VSB); residual carrier for B and for video signal in accordance with “ITU-T J.63 line 17 and line 330” or “NTC-7 Composite”; ...
Page 62
... NXP Semiconductors [18] Measured with an FM deviation of 25 kHz and the typical AF output voltage of 500 mV (RMS). The audio signal processing stage provides headroom with THD < 1.5 %. The steps of 6 dB. Reducing the audio gain for handling a frequency deviation of more than 55 kHz avoids AF output signal clipping. [19] Amplitude response depends on dimensioning of FM PLL loop fi ...
Page 63
... NXP Semiconductors Fig 8. Typical video signal levels on output pin CVBS (sound carrier off) Fig 9. Ripple rejection condition TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile trap bypass mode normal mode 2.72 V 3.41 V 2.6 V 3.20 V 1.83 V 1.80 V 1 TDA9899 ...
Page 64
... NXP Semiconductors (1) VIF AGC. (2) TAGC; W10 = 00h. (3) TAGC; W10 = 10h. (4) TAGC; W10 = 1Fh. Fig 10. Typical VIF monitor and TAGC characteristic (1) CVBS output peak-to-peak level to input (IF1 or IF2) RMS level ratio. Fig 11. Typical VAGC control characteristic (pin AGCVIN) TDA9899_3 Product data sheet ...
Page 65
... NXP Semiconductors Fig 12. Typical tuner takeover point as a function of I (1) IF based TAGC (TOP2). Fig 13. Typical tuner takeover point as a function of resistor R TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile 100 V i(IF) ( Integral TAGC (W9); step width: 1 based TAGC (W10). ...
Page 66
... NXP Semiconductors 5 V AGC(FM) ( Fig 14. Typical FM AGC characteristic measured at pin MPP2 TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile 001aad356 5 V AGC(SIF) ( 100 120 20 V (dB V) i(EXTFMI) (1) AM. (2) FM. Fig 15. Typical SIF AGC characteristic measured at pin MPP2 Rev. 03 — 15 January 2008 ...
Page 67
... NXP Semiconductors 250 (5) f AFC(VIF) (kHz) 150 150 250 36.375 36.875 2 (1) VIF AFC via I C-bus; accuracy is 1 digit. 2 (2) Bit AFCWIN via I C-bus (VCO is in 1.6 MHz window) for all standards except M/N standard. 2 (3) Bit AFCWIN via I C-bus (VCO is in 0.8 MHz window) for M/N standard. ...
Page 68
... NXP Semiconductors Fig 18. RC network for measurement of analog AFC characteristic (1) B/G standard; weighted video S/N; using 50 % grey picture. (2) M/N standard; unweighted video S/N; using 50 IRE grey picture. Fig 19. Typical signal-to-noise ratio as a function of VIF input voltage TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile ...
Page 69
... NXP Semiconductors resp(f) (dB) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap amplitude frequency response. Fig 20. Typical amplitude frequency response for sound trap at M/N standard (including t d(grp) (ns) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap group delay response. ...
Page 70
... NXP Semiconductors resp(f) (dB) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap amplitude frequency response. Fig 22. Typical amplitude frequency response for sound trap at B/G standard t d(grp) (ns) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap group delay response. ...
Page 71
... NXP Semiconductors resp(f) (dB) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap amplitude frequency response. Fig 24. Typical amplitude frequency response for sound trap at I standard t d(grp) (ns) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap group delay response. ...
Page 72
... NXP Semiconductors resp(f) (dB) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap amplitude frequency response. Fig 26. Typical amplitude frequency response for sound trap at D/K standard t d(grp) (ns) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap group delay response. ...
Page 73
... NXP Semiconductors resp(f) (dB) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap amplitude frequency response. Fig 28. Typical amplitude frequency response for sound trap at L standard t d(grp) (ns) (1) Minimum requirements upper limit. (2) Minimum requirements lower limit. (3) Typical trap group delay response. ...
Page 74
... NXP Semiconductors resp(f) (dB) (1) Center frequency. (2) Minimum upper cut-off frequency. (3) Minimum lower cut-off frequency. (4) Maximum upper cut-off frequency. (5) Maximum lower cut-off frequency. (6) Minimum upper stop-band attenuation. (7) Minimum lower stop-band attenuation. Fig 30. Typical sound BP amplitude frequency response at TV mode, normalized to BP TDA9899_3 ...
Page 75
... NXP Semiconductors resp(f) (dB) (1) Center frequency. (2) Minimum upper cut-off frequency. (3) Minimum lower cut-off frequency. (4) Maximum upper cut-off frequency. (5) Maximum lower cut-off frequency. (6) Minimum upper stop-band attenuation. (7) Minimum lower stop-band attenuation. Fig 31. Typical sound BP amplitude frequency response at radio 10.7 mode, normalized to THD (%) Fig 32 ...
Page 76
... NXP Semiconductors Fig 33. Typical WAFP (FM) control output voltage on pin MPP2 versus equivalent FM noise (1) AF output level cut-off frequency. (2) Upper AF cut-off frequency. (3) Lower AF cut-off frequency. Fig 34. Typical FM AF output characteristic versus equivalent FM noise signal using TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile ...
Page 77
... NXP Semiconductors Fig 35. Weighted FM audio S/N versus reference frequency input level using TSS mode TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile 55 (S/N) w (dB Reference frequency input signal taken from external quartz circuit. Rev. 03 — 15 January 2008 TDA9899 001aaf468 ...
Page 78
... NXP Semiconductors 120 antenna input level (dB V) 100 (1) Signal levels for 1 dB video output level using maximum RF gain and maximum IF gain. (2) Signal levels for +1 dB video output level using minimum IF gain. (3) Signal levels for TOP-adjusted tuner output level using maximum RF gain and (4) Signal levels for TOP-adjusted tuner output level using minimum RF gain and (5) TOP-adjusted tuner output level ...
Page 79
... NXP Semiconductors 12.2 Digital TV signal processing Table 58. Characteristics [ MHz system; see P amb (RMS MHz for low IF output of 5 MHz; IF input from 50 i(IF) IF gain controlled amplifier adjusted to typical specified output level; measurements taken in test circuit of crystal oscillator reference; unless otherwise specified. ...
Page 80
... NXP Semiconductors Table 58. Characteristics …continued [ MHz system; see P amb (RMS MHz for low IF output of 5 MHz; IF input from 50 i(IF) IF gain controlled amplifier adjusted to typical specified output level; measurements taken in test circuit of crystal oscillator reference; unless otherwise specified. Symbol ...
Page 81
... NXP Semiconductors Table 58. Characteristics …continued [ MHz system; see P amb (RMS MHz for low IF output of 5 MHz; IF input from 50 i(IF) IF gain controlled amplifier adjusted to typical specified output level; measurements taken in test circuit of crystal oscillator reference; unless otherwise specified. Symbol ...
Page 82
... NXP Semiconductors Table 58. Characteristics …continued [ MHz system; see P amb (RMS MHz for low IF output of 5 MHz; IF input from 50 i(IF) IF gain controlled amplifier adjusted to typical specified output level; measurements taken in test circuit of crystal oscillator reference; unless otherwise specified. Symbol Parameter stop-band attenuation 3.0 MHz band ...
Page 83
... NXP Semiconductors Table 58. Characteristics …continued [ MHz system; see P amb (RMS MHz for low IF output of 5 MHz; IF input from 50 i(IF) IF gain controlled amplifier adjusted to typical specified output level; measurements taken in test circuit of crystal oscillator reference; unless otherwise specified. Symbol Parameter Tuner AGC ...
Page 84
... NXP Semiconductors Table 58. Characteristics …continued [ MHz system; see P amb (RMS MHz for low IF output of 5 MHz; IF input from 50 i(IF) IF gain controlled amplifier adjusted to typical specified output level; measurements taken in test circuit of crystal oscillator reference; unless otherwise specified. Symbol Parameter Conversion synthesizer PLL ...
Page 85
... NXP Semiconductors Table 58. Characteristics …continued [ MHz system; see P amb (RMS MHz for low IF output of 5 MHz; IF input from 50 i(IF) IF gain controlled amplifier adjusted to typical specified output level; measurements taken in test circuit of crystal oscillator reference; unless otherwise specified. Symbol Parameter Reference frequency generation with crystal ...
Page 86
... NXP Semiconductors Table 58. Characteristics …continued [ MHz system; see P amb (RMS MHz for low IF output of 5 MHz; IF input from 50 i(IF) IF gain controlled amplifier adjusted to typical specified output level; measurements taken in test circuit of crystal oscillator reference; unless otherwise specified. Symbol Parameter Reference frequency output ...
Page 87
... NXP Semiconductors Table 59. f (MHz) VCO 53.5 57 [1] Calculation of the PLL loop filter by using the following formulae, valid under the condition for the damping factor d parameters K = VCO steepness (MHz/V divider ratio phase frequency detector steepness ( A/rad LFSYN2 C LFSYN2 B LF( 3dB damping factor ...
Page 88
... NXP Semiconductors (1) Direct IF. (2) Low IF. (3) Zero IF. Fig 38. Typical C/N ratio as a function of IF input voltage (1) 0.25 V for W4[ Fig 39. Direct IF signal conditions for measurement of intermodulation at OUT2 (1) 0.5 V for W4[ Fig 40. Zero IF signal conditions for measurement of intermodulation at OUT1 and OUT2 TDA9899_3 Product data sheet ...
Page 89
... NXP Semiconductors (1) 0.25 V for W4[ Fig 41. Low IF signal conditions for measurement of intermodulation at OUT1 (1) 1.0 V for W4[ Fig 42. Low IF signal conditions for measurement of harmonics at OUT1 (1) Channel bandwidth = 6 MHz. (2) Channel bandwidth = 7 MHz. (3) Channel bandwidth = 8 MHz. Fig 43. Detailed low IF amplitude and group delay pass-band tolerance scheme ...
Page 90
... NXP Semiconductors (1) Channel bandwidth = 6 MHz. (2) Channel bandwidth = 7 MHz. (3) Channel bandwidth = 8 MHz. Fig 44. Low IF amplitude stop-band tolerance scheme (1) Channel bandwidth = 6 MHz. (2) Channel bandwidth = 7 MHz. (3) Channel bandwidth = 8 MHz. Fig 45. Low IF amplitude pass-band tolerance scheme TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile ...
Page 91
... NXP Semiconductors (1) 2.0 V (p-p) differential output voltage (LIF or ZIF, W9[ W4[7] = 0). (2) 1.0 V (p-p) differential output voltage (LIF or ZIF, W9[ W4[ DIF, W9[ (3) 0.5 V (p-p) differential output voltage (DIF, W9[ W4[7] = 1). (4) 2.0 V (p-p) differential output voltage (LIF or ZIF, W9[ W4[7] = 0). (5) 1.0 V (p-p) differential output voltage (LIF or ZIF, W9[ W4[ DIF, W9[ (6) 0 ...
Page 92
... NXP Semiconductors (1) (2) (3) Fig 47. Typical synthesizer phase noise at carrier frequency plus f on LIF output versus TDA9899_3 Product data sheet Multistandard hybrid IF processing including car mobile 105 n(synth) (dBc/Hz) (1) ( 100 MHz MHz synth 100 kHz kHz kHz. input voltage on pin FREF Rev. 03 — ...
Page 93
... NXP Semiconductors 13. Application information C TAGC synthesizer downconverter (4) loop filter LFSYN2 C LFSYN2 n.c. C IFAGC 470 nF X3450L SAW VIF/SIF/DIF 7 MHz WINDOW C CTAGC IF 390 nF SAW VIF/SIF/DIF 6 MHz WINDOW MPP1 loop filter (1) Connect resistor if external reference signal is not used. (2) Connect resistor if crystal is not used. (3) Use of crystal is optional. ...
Page 94
... NXP Semiconductors 14. Test information synthesizer downconverter (4) loop filter LFSYN2 C LFSYN2 n.c. SIF/DIF IFAGC 470 nF VIF/SIF/DIF CTAGC 100 nF VIF/SIF/DIF TOP potentiometer for RSSI and positive modulation 22 k MPP1 +5 V only for port 2.7 k function (1) Connect resistor if external reference signal is not used. (2) Connect resistor if crystal is not used. ...
Page 95
... NXP Semiconductors 15. Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) A UNIT max. 0.20 1.45 1.6 mm 0.25 0.05 1.35 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION ...
Page 96
... NXP Semiconductors HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 0.85 mm terminal 1 index area terminal 1 48 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
Page 97
... NXP Semiconductors 16. Soldering 16.1 Introduction There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 16.2 Through-hole mount packages 16 ...
Page 98
... NXP Semiconductors Table 60. Package thickness (mm) < 2.5 2.5 Table 61. Package thickness (mm) < 1.6 1.6 to 2.5 > 2.5 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Fig 52. Temperature profiles for large and small components For further information on temperature profi ...
Page 99
... NXP Semiconductors To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ...
Page 100
... NXP Semiconductors Table 62. Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Package Surface mount BGA, HTSSON..T LFBGA, SQFP, SSOP..T VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS [7] PLCC LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN ...
Page 101
... NXP Semiconductors Table 63. Abbreviations …continued Acronym Description DIF Digital Intermediate Frequency DSP Digital Signal Processor DTV Digital TV DVB Digital Video Broadcast ESD ElectroStatic Discharge FPLL Frequency Phase-Locked Loop IC Integrated Circuit IF Intermediate Frequency LCD Liquid Crystal Display LIF Low Intermediate Frequency MAD ...
Page 102
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 103
... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Analog TV processing 2.3 Digital TV processing . . . . . . . . . . . . . . . . . . . . 2 2.4 Dual mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.5 FM radio mode . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 7 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 Pinning information . . . . . . . . . . . . . . . . . . . . . 10 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 11 8 Functional description ...