HD64F3048BF25 Renesas Electronics America, HD64F3048BF25 Datasheet - Page 95

IC H8 MCU FLASH 128K 100QFP

HD64F3048BF25

Manufacturer Part Number
HD64F3048BF25
Description
IC H8 MCU FLASH 128K 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3048BF25

Core Processor
H8/300H
Core Size
16-Bit
Speed
8MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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2.9
2.9.1
The H8/300H CPU operates according to the system clock ( ). The interval from one rise of the
system clock to the next rise is referred to as a “state.” A memory cycle or bus cycle consists of
two or three states. The CPU uses different methods to access on-chip memory, the on-chip
supporting modules, and the external address space. Access to the external address space can be
controlled by the bus controller.
2.9.2
On-chip memory is accessed in two states. The data bus is 16 bits wide, permitting both byte and
word access. Figure 2.15 shows the on-chip memory access cycle. Figure 2.16 indicates the pin
states.
Overview
On-Chip Memory Access Timing
Basic Operational Timing
Internal address bus
Internal read signal
Internal data bus
(read access)
Internal write signal
Internal data bus
(write access)
Figure 2.15 On-Chip Memory Access Cycle
T state
1
Bus cycle
Address
Rev. 3.00 Sep 27, 2006 page 67 of 872
Read data
Write data
T state
2
REJ09B0325-0300
Section 2 CPU

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