MC9S08GB60CFU Freescale Semiconductor, MC9S08GB60CFU Datasheet - Page 275

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MC9S08GB60CFU

Manufacturer Part Number
MC9S08GB60CFU
Description
IC MCU 60K FLASH 20MHZ 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08GB60CFU

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
56
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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A.9.3
Table A-12
Freescale Semiconductor
and
SPI Timing
External clock frequency
External clock period
External clock high time
External clock low time
Input capture pulse width
Figure A-16
TPMxCHn
Function
through
TPMxCHn
TPMxCHn
Figure A-15. Timer Input Capture Pulse
Figure A-14. Timer External Clock
MC9S08GB/GT Data Sheet, Rev. 2.3
Figure A-19
Table A-11. TPM Input Timing
t
clkh
Symbol
f
t
describe the timing requirements for the SPI system.
TPMext
TPMext
t
ICPW
t
t
clkh
clkl
t
t
ICPW
ICPW
t
Text
t
clkl
Min
1.5
1.5
1.5
dc
4
f
Max
Bus
/4
MHz
Unit
t
t
t
t
cyc
cyc
cyc
cyc
AC Characteristics
275

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