MC9S12XA256CAL Freescale Semiconductor, MC9S12XA256CAL Datasheet - Page 1246

• Manufacturer Part Number: MC9S12XA256CAL
• Description: IC MCU 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XA256CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 80MHz
• No. Of Timers: 1
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XA
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (10 bit, 16 Channel)
• Package: 112LQFP
• Family Name: HCS12
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 2.5|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
1
2
3
1248
Conditions are 4.5 V < V
I/O Characteristics for all I/O pins except EXTAL, XTAL,XFC,TEST, VREGEN and supply pins.
Num C
10
11
12
13
14
15
16
17
18
Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8 C to 12 C in the temper ature range from 50 C to 125 C.
Refer to
Parameter only applies in stop or pseudo stop mode.
1
2
3
4
5
6
7
8
9
C Input hysteresis
C Output high voltage (pins in output mode)
C Output low voltage (pins in output mode)
C Internal pull up device current, tested at V
C Internal pull down device current, tested at V
D Input capacitance
P Input high voltage
T Input high voltage
P Input low voltage
T Input low voltage
P Input leakage current (pins in high impedance input
P Output high voltage (pins in output mode)
P Output low voltage (pins in output mode)
P Internal pull up device current, tested at V
P Internal pull down device current, tested at V
P Internal pull up resistance
P Internal pull down resistance
T Injection current
P Port H, J, P interrupt input pulse filtered
P Port H, J, P interrupt input pulse passed
Internal pull up/pull down device specification (items 9 to 12) only valid for masksets 0L15Y & 1L15Y
Section A.1.4, “Current Injection”
mode)
VIH min > input voltage > VIL max
VIH min > input voltage > VIL max
Measured at V in = 5.5V and V
Partial drive I OH = –2 mA
Full drive I
Partial drive I
Full drive I OL = +10 mA
Single pin limit
Total device Limit, sum of all injected currents
Internal pull up/pull down device specification (items 13 to 14) valid for all other masksets
1
OH
DD35
OL
2
= –10 mA
< 5.5 V temperature from –40 C to +140 C, unless otherwise noted
= +2 mA
Rating
MC9S12XDP512 Data Sheet, Rev. 2.21
Table A-7. 5-V I/O Characteristics
for more details
in
=0V
3
3
IL
IH
max
min
IH
IL
max
min
Symbol
t
t
V HYS
R
PULSE
PULSE
R
I
I
V
V
I
I
V
V
I
I
V
V
PUH
PDH
V
V
PUL
PDL
C
ICS
ICP
I
PDH
PUL
OH
OH
OL
OL
in
IH
IH
IL
IL
in
V
V
0.65*V
V
DD35
DD35
SS35
–2.5
Min
–10
–25
–1
10
25
25
10
—
—
—
—
—
—
—
—
– 0.3
– 0.8
– 0.8
DD35
Typ
250
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6
Freescale Semiconductor
V
0.35*V
DD35
–130
Max
130
0.8
0.8
2.5
55
55
25
—
—
—
—
—
—
—
—
—
1
3
+ 0.3
DD35
Unit
mV
mA
K
K
pF
V
V
V
V
V
V
V
V
A
A
A
A
A
s
s