PIC18F452-E/P Microchip Technology, PIC18F452-E/P Datasheet - Page 18

IC MCU CMOS 40MHZ 16K FLSH 40DIP

PIC18F452-E/P

Manufacturer Part Number
PIC18F452-E/P
Description
IC MCU CMOS 40MHZ 16K FLSH 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F452-E/P

Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
34
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
MSSP/SPI/I2C/PSP/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
34
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
40PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F452-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
PIC18F452-E/PT
Quantity:
52
PIC18FXX2/XX8
3.4
The ID locations are programmed much like the code
memory, except that multi-panel writes must be
disabled. The single panel that will be written will auto-
matically be enabled, based on the value of the Table
Pointer. The ID registers are mapped in addresses
200000h through 200007h. These locations read out
normally, even after code protection.
TABLE 3-7:
In order to modify the ID locations, refer to the
methodology described in Section 3.2.2, “Modifying
Code Memory”. As with code memory, the ID locations
must be erased before modified.
DS39576C-page 18
Step 1: Direct access to config memory.
Step 2: Configure device for single panel writes.
Step 3: Direct access to code memory.
Step 4: Load write buffer. Panel will be automatically determined by address.
Command
0000
0000
0000
0000
0000
0000
0000
0000
1100
0000
0000
0000
0000
0000
0000
0000
0000
1101
1101
1101
1111
0000
4-Bit
ID Location Programming
8E A6
8C A6
0E 3C
6E F8
0E 00
6E F7
0E 06
6E F6
00 00
8E A6
9C A6
0E 20
6E F8
0E 00
6E F7
0E 00
6E F6
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
00 00
WRITE ID SEQUENCE
Data Payload
BSF
BSF
MOVLW 3Ch
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 06h
MOVWF TBLPTRL
Write 00h to 3C0006h to enable single panel writes.
BSF
BCF
MOVLW 20h
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 00h
MOVWF TBLPTRL
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes and start programming
NOP - hold SCLK high for time P9
EECON1, EEPGD
EECON1, CFGS
EECON1, EEPGD
EECON1, CFGS
Figure 3-7 demonstrates the code sequence required
to write the ID locations.
Note:
Core Instruction
For single panel programming, the user
must still fill the 8-byte data buffer for the
panel.
 2010 Microchip Technology Inc.

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