PIC18C252-I/SO Microchip Technology, PIC18C252-I/SO Datasheet - Page 6

• Manufacturer Part Number: PIC18C252-I/SO
• Description: IC MCU OTP 16KX16 A/D 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Cr

Specifications of PIC18C252-I/SO

• Core Size: 8-Bit
• Program Memory Size: 32KB (16K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 24
• Ram Memory Size: 1536Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Interface: I2C, SPI, USART
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 23
• Interface Type: I2C/SPI/USART
• On-chip Adc: 5-chx10-bit
• Number Of Timers: 4
• Embedded Interface Type: I2C, SPI, USART
• Rohs Compliant: Yes
• Processor Series: PIC18C
• Core: PIC
• Data Ram Size: 1536 B
• Maximum Clock Frequency: 40 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: ICE2000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18C452 - BOARD DAUGHTER ICEPIC3309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC18CXX2
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer1 Module .......................................................................................................................................................................... 97
11.0 Timer2 Module ........................................................................................................................................................................ 101
12.0 Timer3 Module ........................................................................................................................................................................ 103
13.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................ 107
14.0 Master Synchronous Serial Port (MSSP) Module................................................................................................................... 115
15.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART) ............................................................ 149
16.0 Compatible 10-bit Analog-to-Digital Converter (A/D) Module ................................................................................................. 165
17.0 Low Voltage Detect................................................................................................................................................................. 173
18.0 Special Features of the CPU .................................................................................................................................................. 179
19.0 Instruction Set Summary......................................................................................................................................................... 187
20.0 Development Support ............................................................................................................................................................. 229
21.0 Electrical Characteristics......................................................................................................................................................... 235
22.0 DC and AC Characteristics Graphs and Tables ..................................................................................................................... 263
23.0 Packaging Information ............................................................................................................................................................ 277
Appendix A:
Appendix B:
Appendix C: Conversion Considerations........................................................................................................................................ 288
Appendix D: Migration from Baseline to Enhanced Devices .......................................................................................................... 288
Appendix E:
Appendix F:
Index ................................................................................................................................................................................................. 291
On-Line Support................................................................................................................................................................................ 299
Reader Response ............................................................................................................................................................................. 300
PIC18CXX2 Product Identification System ....................................................................................................................................... 301
DS39026C-page 4
Device Overview ......................................................................................................................................................................... 7
Oscillator Configurations........................................................................................................................................................... 17
Reset......................................................................................................................................................................................... 25
Memory Organization................................................................................................................................................................ 35
Table Reads/Table Writes ........................................................................................................................................................ 55
8 X 8 Hardware Multiplier.......................................................................................................................................................... 61
Interrupts................................................................................................................................................................................... 63
I/O Ports.................................................................................................................................................................................... 77
Timer0 Module .......................................................................................................................................................................... 93
Revision History ......................................................................................................................................................... 287
Device Differences..................................................................................................................................................... 287
Migration from Mid-Range to Enhanced Devices ...................................................................................................... 289
Migration from High-End to Enhanced Devices ......................................................................................................... 289
2001 Microchip Technology Inc.