PIC18C252-I/SO Microchip Technology, PIC18C252-I/SO Datasheet - Page 283

IC MCU OTP 16KX16 A/D 28SOIC

PIC18C252-I/SO

Manufacturer Part Number
PIC18C252-I/SO
Description
IC MCU OTP 16KX16 A/D 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Cr

Specifications of PIC18C252-I/SO

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
OTP
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
24
Ram Memory Size
1536Byte
Cpu Speed
40MHz
No. Of Timers
4
Interface
I2C, SPI, USART
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
23
Interface Type
I2C/SPI/USART
On-chip Adc
5-chx10-bit
Number Of Timers
4
Embedded Interface Type
I2C, SPI, USART
Rohs Compliant
Yes
Processor Series
PIC18C
Core
PIC
Data Ram Size
1536 B
Maximum Clock Frequency
40 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
ICE2000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18C452 - BOARD DAUGHTER ICEPIC3309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18C252-I/SO
Manufacturer:
Microchip Technology
Quantity:
1 840
Part Number:
PIC18C252-I/SO
Manufacturer:
Microchip
Quantity:
400
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
2001 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
n
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
A
A1
MIN
2.045
.160
.140
.015
.595
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
40
10
10
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
15.75
13.46
51.94
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
PIC18CXX2
NOM
15.24
13.84
52.26
16.51
2.54
4.45
3.30
0.29
1.27
0.46
3.81
40
10
10
p
DS39026C-page 281
MAX
A2
15.88
14.22
52.45
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15

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