PIC18C252-I/SO Microchip Technology, PIC18C252-I/SO Datasheet - Page 305

• Manufacturer Part Number: PIC18C252-I/SO
• Description: IC MCU OTP 16KX16 A/D 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Cr

Specifications of PIC18C252-I/SO

• Core Size: 8-Bit
• Program Memory Size: 32KB (16K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 24
• Ram Memory Size: 1536Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Interface: I2C, SPI, USART
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 23
• Interface Type: I2C/SPI/USART
• On-chip Adc: 5-chx10-bit
• Number Of Timers: 4
• Embedded Interface Type: I2C, SPI, USART
• Rohs Compliant: Yes
• Processor Series: PIC18C
• Core: PIC
• Data Ram Size: 1536 B
• Maximum Clock Frequency: 40 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: ICE2000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18C452 - BOARD DAUGHTER ICEPIC3309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC18CXX2
Table of Contents
1.01.0Device Overview .................................................................................................................................................. 7
2.02.0Oscillator Configurations .................................................................................................................................... 17
3.03.0Reset.................................................................................................................................................................. 25
4.04.0Memory Organization......................................................................................................................................... 35
5.05.0Table Reads/Table Writes.................................................................................................................................. 55
6.06.08 X 8 Hardware Multiplier................................................................................................................................... 61
7.07.0Interrupts ............................................................................................................................................................ 63
8.08.0I/O Ports ............................................................................................................................................................. 77
9.09.0Timer0 Module ................................................................................................................................................... 93
10.010.0Timer1 Module ............................................................................................................................................... 97
11.011.0Timer2 Module ............................................................................................................................................. 101
12.012.0Timer3 Module ............................................................................................................................................. 103
13.013.0Capture/Compare/PWM (CCP) Modules ..................................................................................................... 107
14.014.0Master Synchronous Serial Port (MSSP) Module ........................................................................................ 115
15.015.0Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART) ................................. 149
16.016.0Compatible 10-bit Analog-to-Digital Converter (A/D) Module ...................................................................... 165
17.017.0Low Voltage Detect ...................................................................................................................................... 173
18.018.0Special Features of the CPU ....................................................................................................................... 179
19.019.0Instruction Set Summary.............................................................................................................................. 187
20.020.0Development Support .................................................................................................................................. 229
21.021.0Electrical Characteristics.............................................................................................................................. 235
22.022.0DC and AC Characteristics Graphs and Tables........................................................................................... 263
23.023.0Packaging Information ................................................................................................................................. 277
Appendix A:Revision History...................................................................................................................................... 287
Appendix B:Device Differences.................................................................................................................................. 287
Appendix C:Conversion Considerations .................................................................................................................... 288
Appendix D:Migration from Baseline to Enhanced Devices....................................................................................... 288
Appendix E:Migration from Mid-range to Enhanced Devices..................................................................................... 289
Appendix F:Migration from High-end to Enhanced Devices ...................................................................................... 289
INDEX ........................................................................................................................................................................ 291
On-Line Support......................................................................................................................................................... 299
Reader Response ...................................................................................................................................................... 300
PIC18CXX2 Product Identification System ................................................................................................................ 301
2001 Microchip Technology Inc.
DS39026B-page 1