KIT33886DHEVB Freescale Semiconductor, KIT33886DHEVB Datasheet - Page 22

• Manufacturer Part Number: KIT33886DHEVB
• Description: KIT EVAL FOR MC33886 H-BRIDGE
• Manufacturer: Freescale Semiconductor

Specifications of KIT33886DHEVB

• Main Purpose: Power Management, H Bridge Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33886
• Primary Attributes: 5 V ~ 40 V Supply, 5A Output
• Secondary Attributes: Short-Circuit, Thermal & Undervoltage Protection
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Device on Thermal Test Board
22
33886
5.0 A H-BRIDGE
THERMAL ADDENDUM - REVISION 2.0
Material:
Outline:
Area A:
Ambient Conditions:
AGND
PGND
PGND
OUT1
OUT1
DNC
IN1
FS
V+
V+
12.2 mm x 6.9 mm Exposed Pad
33886 Pin Connections
1
2
3
4
5
6
7
8
9
10
16.0 mm x 11.0 mm Body
20-Pin HSOP
1.27 mm Pitch
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
Natural convection, still air
20
19
18
17
16
15
14
13
12
11
DNC
IN2
D1
C
V+
OUT2
OUT2
D2
PGND
PGND
CP
Figure 25. Thermal Test Board
Table 7.
ambient air.
reference location on the board surface near a center lead of the
package (see
R
R
Resistance
θ
θ
JA
JS
Thermal
R
R
is the thermal resistance between die junction and
is the thermal resistance between die junction and the
θ
θ
JA
JS
Thermal Resistance Performance
Figure 25
A
Area A (mm
Analog Integrated Circuit Device Data
).
300
600
300
600
0.0
0.0
2
Freescale Semiconductor
)
°C/W
7.0
6.0
52
36
32
10