KIT33886DHEVB Freescale Semiconductor, KIT33886DHEVB Datasheet - Page 21

• Manufacturer Part Number: KIT33886DHEVB
• Description: KIT EVAL FOR MC33886 H-BRIDGE
• Manufacturer: Freescale Semiconductor

Specifications of KIT33886DHEVB

• Main Purpose: Power Management, H Bridge Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33886
• Primary Attributes: 5 V ~ 40 V Supply, 5A Output
• Secondary Attributes: Short-Circuit, Thermal & Undervoltage Protection
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

5.0 A H-BRIDGE
THERMAL ADDENDUM - REVISION 2.0
Introduction
technical data sheet. The addendum provides thermal performance information
that may be critical in the design and development of system applications. All
electrical, application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
There is a single heat source (P), a single junction temperature (T
resistance (R
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Table 6.
Analog Integrated Circuit Device Data
Freescale Semiconductor
NOTES:
trace near the center lead.
JESD51-5.
pad surface; cold plate attached to the package bottom side,
remaining surfaces insulated.
1.Per JEDEC JESD51-2 at natural convection, still air condition.
2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7.
3.Per JEDEC JESD51-8, with the board temperature on the center
4.Single layer thermal test board per JEDEC JESD51-3 and
5.Thermal resistance between the die junction and the exposed
This thermal addendum is provided as a supplement to the MC33186
The MC33186 is offered in a 20 pin HSOP exposed pad, single die package.
The stated values are solely for a thermal performance comparison of one
Thermal Resistance
Thermal Performance Comparison
R
R
R
R
θJA
θJB
θJA
θJA
θJC
(1)(2)
(2)(3)
(1)(4)
).
(5)
T
J
=
R
θJA
.
P
[°C/W]
6.0
1.0
20
52
J
), and thermal
Figure 24. Thermal Land Pattern for Direct Thermal
12.2 mm x 6.9 mm Exposed Pad
Attachment According to JESD51-5
20 Terminal HSOP-EP
16.0 mm x 11.0 mm Body
Note For package dimensions, refer to
the 33886 device data sheet.
1.27 mm Pitch
THERMAL ADDENDUM - REVISION 2.0
VW (Pb-FREE) SUFFIX
20-PIN HSOP-EP
98ASH70702A
DH SUFFIX
33886
HSOP-EP
20-PIN
* All measurements
0.2
are in millimeters
Soldermast
openings
Thermal vias
connected to top
buried plane
1.0
5.0 A H-BRIDGE
0.2
1.0
33886
21