KIT33886DHEVB Freescale Semiconductor, KIT33886DHEVB Datasheet - Page 4

• Manufacturer Part Number: KIT33886DHEVB
• Description: KIT EVAL FOR MC33886 H-BRIDGE
• Manufacturer: Freescale Semiconductor

Specifications of KIT33886DHEVB

• Main Purpose: Power Management, H Bridge Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33886
• Primary Attributes: 5 V ~ 40 V Supply, 5A Output
• Secondary Attributes: Short-Circuit, Thermal & Undervoltage Protection
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

4
33886
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
permanent damage to the device.
Notes
Supply Voltage
Input Voltage
FS Status Output
Continuous Current
ESD Voltage for VW Package
Storage Temperature
Ambient Operating Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W)
1.
2.
3.
4.
5.
6.
7.
8.
9.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
Human Body Model
Machine Model
Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
Exceeding the pull-up resistor voltage on the open drain FS pin may cause permanent damage to the device.
Continuous current capability so long as junction temperature is ≤ 150
ESD1 testing is performed in accordance with the Human Body Model (C
ESD2 testing is performed in accordance with the Machine Model (C
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R
values will vary depending on solder thickness and composition and copper trace.
(1)
(2)
(5)
(3)
(9)
(4)
Rating
(6)
ELECTRICAL CHARACTERISTICS
(7)
,
(8)
MAXIMUM RATINGS
ZAP
Symbol
°
V
V
T
C.
T
R
I
V
V
OUT
ESD1
ESD2
PPRT
V+
T
STG
T
θ
= 200 pF, R
ZAP
FS
IN
A
J
JB
= 100 pF, R
ZAP
= 0 Ω).
ZAP
Analog Integrated Circuit Device Data
= 1500 Ω).
-0.1 to 7.0
-65 to 150
-40 to 125
-40 to 150
Note 7.
±2000
Value
±200
~5.0
7.0
5.0
40
Freescale Semiconductor
θ
JB
(junction-to-PC board)
°C/W
Unit
°C
°C
°C
°C
V
V
V
A
V