KIT33886DHEVB Freescale Semiconductor, KIT33886DHEVB Datasheet - Page 17

• Manufacturer Part Number: KIT33886DHEVB
• Description: KIT EVAL FOR MC33886 H-BRIDGE
• Manufacturer: Freescale Semiconductor

Specifications of KIT33886DHEVB

• Main Purpose: Power Management, H Bridge Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33886
• Primary Attributes: 5 V ~ 40 V Supply, 5A Output
• Secondary Attributes: Short-Circuit, Thermal & Undervoltage Protection
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

SHORT-CIRCUIT PROTECTION
outputs tri-state (latch-OFF) independent of the input (IN1
and IN2) states, and the fault status output flag is set logic
Low. If the D1 input changes from logic High to logic Low, or
if the
output bridge will become operational again and the fault
status flag will be reset (cleared) to a logic High state.
by the input pins (IN1, IN2, D1, and D2), provided the device
junction temperature is within the specified operating
temperature.
ACTIVE CURRENT LIMITING
conditions is internally limited to I
the maximum current value is reached, the output stages are
tri-stated for a fixed time (t
the time constant associated with the load characteristics, the
current decreases during the tri-state duration until the next
output ON cycle occurs (see
page 10, respectively).
device junction temperature. When -40 °C < T
is between 5.2 A and 7.8 A. When T
I
175 °C. Above 175°C the device over-temperature circuit
detects T
Figure
Analog Integrated Circuit Device Data
Freescale Semiconductor
LIM
If an output short-circuit condition is detected, the power
The output stage will always switch into the mode defined
The maximum current flow under normal operating
The current limiting threshold value is dependent upon the
current decreases linearly down to 2.5 A typical at
D2
7, page 8). This feature allows the device to remain
input changes from logic Low to logic High, the
LIM
and over-temperature shutdown occurs (see
a
) of 20 μs typical. Depending on
Figures 9
LIM
J
(5.2 A to 7.8 A). When
exceeds 160 °C, the
FUNCTIONAL DEVICE OPERATION
and 12, page
J
< 160 °C, I
9
and
LIM
operational for a longer time but at a regressing output
performance level at junction temperatures above 160 °C.
OVER-TEMPERATURE SHUTDOWN AND
HYSTERESIS
are tri-state (latched-OFF) independent of the input signals
and the fault status flag is set logic Low.
High to logic Low, or D2 must change from logic Low to logic
High. When reset, the output stage switches ON again,
provided that the junction temperature is now below the over-
temperature threshold limit minus the hysteresis.
status flag.
MAIN DIFFERENCES COMPARED TO
MC33186DH1
• COD pin has been removed. Pin 8 is now a Do Not
• Pin 20 is no longer connected in the 20 HSOP package. It
• R
• Maximum temperature operation is now 160 °C, as
• Current regulation limiting foldback is implemented above
• Thermal resistance junction to case has been increased
If an over-temperature condition occurs, the power outputs
To reset from this condition, D1 must change from logic
Note Resetting from the fault condition will clear the fault
Connect (DNC) pin.
is now a DNC pin.
output transistor.
minimum thermal shutdown temperature has increased.
160 °C T
from ~2.0 °C/W to ~5.0 °C/W.
DS(ON)
max at T
J
.
J
= 150 °C is now 225 mΩ per each
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL PIN DESCRIPTION
33886
17