MPC8308-RDB Freescale Semiconductor, MPC8308-RDB Datasheet - Page 6

• Manufacturer Part Number: MPC8308-RDB
• Description: BOARD REF DESIGN MPC8308
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II™ PROr
• Type: MPUr

Specifications of MPC8308-RDB

• Contents: Board, Cables, Documentation, Power Supply, Software
• Ethernet Connection Type: Serial to Ethernet
• Data Rate: 10 Mbps, 100 Mbps, 1000 Mbps
• Memory Type: DDR2, SDRAM
• Interface Type: HSSI
• Operating Voltage: 1.5 V
• Operating Current: 5 uA
• Maximum Power Dissipation: 1000 mW
• Operating Temperature Range: - 55 C to + 125 C
• Product: Modules
• For Use With/related Products: MPC8308
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Power Characteristics
The I/O power supply ramp-up slew rate should be slower than 4V/100
circuit
Note that there is no specific power down sequence requirement for the device. I/O voltage supplies
(GV
3
The estimated typical power dissipation, not including I/O supply power for the device is shown in
Table 5
6
DD
, LV
Power Characteristics
shows the estimated typical I/O power dissipation.
DD
, and NV
1
2
3
Note:
Core Frequency (MHz)
The values do not include I/O supply power but do include core (V
AV
Typical power is based on best process, a voltage of V
of T
Maximum power is estimated based on best process, a voltage of V
temperature of T
90%
DD2
A
V
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 2
= 25° C and an artificial smoker test.
0
, XCOREV
DD
266
333
400
PORESET
) do not have any ordering requirements with respect to one another.
J
DD
= 105° C
Figure 3. Power-Up Sequencing Example
, XPADV
Table 4. MPC8308 Power Dissipation
CSB Frequency (MHz)
DD
, and SDAV
133
133
133
DD
)
I/O Voltage (GV
>= 32 × t
DD
Typical
Core Voltage (V
530
565
600
SYS_CLK_IN
= 1.0 V and ambient temperature
2
DD
, LV
1
DD
DD
μ
Maximum
s, this requirement is for ESD
DD
) and PLL (AV
= 1.05 V, a junction
1000
, and NV
DD
900
950
)
0.7 V
3
DD
Freescale Semiconductor
)
DD1,
t
Unit
mW
mW
mW
Table
4.