DEMO9S08LG32 Freescale Semiconductor, DEMO9S08LG32 Datasheet - Page 10

• Manufacturer Part Number: DEMO9S08LG32
• Description: DEMO BOARD FOR LG32 FAMILY MCU
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of DEMO9S08LG32

• Contents: Board, CD
• Processor To Be Evaluated: MC9S08LG32x
• Data Bus Width: 8 bit
• Interface Type: USB
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Silicon Manufacturer: Freescale
• Core Architecture: HCS08
• Core Sub-architecture: HCS08
• Silicon Core Number: MC9S08
• Silicon Family Name: S08LG
• Rohs Compliant: Yes
• For Use With/related Products: MC9S08LG32
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

D E M O 9 S 0 8 L G 3 2
U S E R
Power from the integrated BDM is drawn from the USB bus and is limited to 500 mA. This
current limit accounts for the total current supplied over the USB cable to the BDM circuit, the
target board, and any connected circuitry. Current drain in excess of 500 mA will violate the
USB specification and will cause the USB bus to disconnect. This will cause the board to
exhibit power cycling where the board appears to turn-on then off continually. Damage to the
host PC or the target board may also result.
Power input to the VIN barrel connector should not exceed +12V. LCD contrast is connected
directly to the VIN power input.
VX_EN
The VX_EN option header is a 2-pin jumper that connects or disconnects input J1-1 directly to
the target board voltage rail. J1-3 connects directly to the target board ground plane. Use of
this feature requires a regulated input power source.
minimize noise but is not regulated or protected. Care should be exercised when using this
feature; no protection is applied on this input and damage to the target board may result if
excessive voltage is applied. Also, do not attempt to power the target board through this
connector while also applying power through the USB-Multilink BDM or the PWR connector;
damage to the board may result.
Power may also be sourced to off-board circuitry through the J1 connector. The current
supplied from the USB bus or the on-board regulator limits current available to external
circuitry. Excessive current drain may damage the target board, the host PC USB hub, or the
on-board regulator. The figure below details the VX_EN header connections.
Figure 5: VX_EN Option Header
G U I D E
Voltage input exceeding +12V applied to VIN may damage the target board
Total power from the USB-BDM is limited to 500 mA. Exceeding this limit
violates the USB specification and will cause the USB bus to disconnect.
VX_EN
Damage to the target board and the host PC may result.
Enabled
ON
Disabled
OFF
CAUTION:
CAUTION:
10
This power input is decoupled to
F E B R U A R Y
2 4 ,
2 0 0 9